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Semiconductor device and method of manufacturing the same
   
Document Number
US Patent 7554169
Issued Date
June 30, 2009
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Abstract
It is provided a contacting method when a plurality of films to be peeled are laminating. Reduction of total layout area, miniaturization of a module, weight reduction, thinning, narrowing a frame of a display device, or the like can be realized by sequentially laminating a plurality of films to be peeled which are once separately formed over a plastic film or the like. Moreover, reliable contact having high degree of freedom is realized by forming each layer having a connection face of a conductive material and by patterning with the use of a photomask having the same pattern.
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Number of Claims:
18
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Owner
Semiconductor Energy Laboratory Co., Ltd. (Atsugi-shi, Kanagawa-ken,JP)
Published
June 30, 2009
Application Number
11/107,821
Filed
April 18, 2005
US Classification
257/444   257/292 257/59 257/773 257/786 257/E27.131
Int'l Classification
H01L   31/0224   (20060101)   H01L   23/485   (20060101)   H01L   23/528   (20060101)  
Examiner
Assistant Examiner
Priority Data
Dec 17, 2002 [JP] 2002-365566
USPTO Field of Search
257/444   257/E27.131   257/773   257/786  
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