Devices and methods are described including a multi-chip assembly. Embodiments of multi-chip assemblies are provided that uses both lateral connection structures and through chip connection structures. One advantage of this design includes an increased number of possible connections. Another advantage of this design includes shorter distances for interconnection pathways, which improves device performance and speed.
CROSS-REFERENCE TO RELATED APPLICATIONS
The present application is a divisional of U.S. Ser. No. 10/654,038, filed Sep. 3, 2003, which is herein incorporated by reference in its entirety.
