A bus strip which can be mounted on an array of terminal posts merely by pushing the bus strip into mounting engagement with a desired plurality of terminal posts is disclosed. The bus strip is a one piece configuration having a central spine with a pair of wings radiating in opposite directions from one end of the spine. The spine is provided with a series of holes adjacent the junction of the spine and wings to mount the bus strip on an array of terminal posts, and the wings are contoured so as to spring load the strip against the terminal posts with three points of contact. The bus strip may also be provided with gaps in the wings and spine whereby contact with posts may be skipped as desired.
A double contact electrical bus strip to receive a terminal pin or post comprises: (a) a horizontally elongated bus strip, and (b) two contacts in the form of hook-shaped tangs which are vertically spaced apart and which are integral with the bus strip, (c) each of the tangs extending generally vertically and diagonally relatively toward the bus strip, at one side thereof, (d) the tangs defining vertically spaced openings to pass the terminal post in vertically assembled relation between both tangs and the bus strip.
This invention relates to an electrical terminal system capable of use with fully automated assembly equipment. The terminal system includes a circuit terminal projecting above a base on which a circuit connection may be made. A second terminal projects from an adjacent side of the base forming individual component terminals, providing a mounting point for individual discrete components. The base contains two opposing parallel rows of the terminals and components are mounted between two of such bases. A bus strap may be mounted on top of the base and is held in place by a set of grooves. Terminals extend from the bus strap and may be connected to the individual component terminals. Further an insulating bus may be used where multiple buses are employed.
A bus bar constructed to bend connector posts and make electrical contact with them at three loci of bar points. In vertical section, vertical lines between first and second bus contact points are spaced from third bus contact points adjacent said vertical lines by a distance less than the thickness of the posts, the locus defined by said vertical lines corresponding generally with a locus of post centerlines.
A logic probe system for an integrated circuit device under test, such as a dual in-line package (DIP) device having a plurality of spaced-apart signal pins, comprises a probe header, including a plurality of signal contacts, and a plurality of ground contacts in the probe header body. The signal contacts each include a spring contact for tightly coupling the signal contact to the pins of the device under test, and a pin end protruding from the header body. The ground contacts each comprise a ground pin end protruding upwardly from the header body, and a distal end conductively secured to a ground plane extruding through the header body. An attenuator clip couples one of the signal pins and an adjacent ground pin to an external measuring device in series with a fixed-value resistor. The signal contacts preferably are arranged in parallel rows proximate to the side edges of the header body. The ground contacts are likewise arranged in a second, inboard spaced-apart pair of rows. The attenuator comprises a fixed-value resistor coupled in series with an input socket and an output pin and a ground conductor extending therethrough. The invention further provides a method for testing an integrated circuit, using the device described above, wherein the device is secured to a device under test and coupled using the attenuator clip to a measuring device.
A cable management system includes an adapter plate disposed between a panel and a cabling component, such as a wiring block or wiring trough. The adapter plate includes a first plurality of fasteners and a first plurality of alignment pins extending orthogonally from a first surface, and second plurality of fasteners and a second plurality of alignment pins extending orthogonally from a second surface. The first plurality of fasteners engage tabs formed on the panel and the second plurality of fasteners engage features formed on the cabling component. The first plurality of alignment pins are disposed to engage alignment apertures formed in the panel. The second plurality of alignment pins are disposed to engage alignment apertures formed in the cabling component. The adapter plate can include an abutment portion disposed to abut the panel and cooperate with the first plurality of fasteners to position the adapter plate relative to the panel. The adapter plate can also include integrally molded cabling components to reduce the number of piece parts required for installation of a cabling system.