Adhesives adapted especially for bonding optical elements and consisting of, as major components, a polyfunctional acrylate and a polythiol, a radical generating photoinitiator, a radical generating heatactivated-curing initiator and a stabilizer against premature onset of curing.
An optical prism having a first glass member which has a first surface on which an specific light is irradiated, a second surface which reflects a part of the specific light and passes through the rest of the specific light, and a third surface on which the part of the specific light reflected by the second surface is irradiated in a substantially vertical direction; and a second glass member which has a fourth surface which passes through the rest of the specific light passing through the second surface, and a fifth surface on which the rest of the specific light passing through the forth surface is irradiated in a substantially vertical direction; wherein the third surface and the fifth surface have a resin which hardens by being irradiated the specific light.
A plate 2 with a photodiode PD is positioned with a slight interval with respect to a housing 1, a small amount of an ultraviolet curing adhesive 8a is applied to four portions each located between a corner of either side edge 2a of the plate 2 and the housing 1, the ultraviolet curing adhesive 8a is allowed to cure by application of ultraviolet rays thereto to temporarily fix the plate 2 to the housing 1, an appropriate amount of a thermosetting adhesive is applied to two portions each located between a central portion of either side edge 2a of the plate 2 and the housing 1, and the thermosetting adhesive 8b is allowed to cure by heating so as to finally fix the plate 2 to the housing 1.
A method of manufacturing a solid state image sensing device comprising the steps of: forming and maintaining a color filter layer, a lens layer and/or a light reflection preventing layer via a transparent thermosetting resin layer, on a semiconductor substrate; forming a mask layer of a photosetting resin to expose an electrode on the semiconductor substrate surface after the layer forming and maintaining step; and exposing the electrode surface by selectively removing the transparent thermosetting resin layers by use of the mask layer.
A device for retaining an optical part is disclosed, which comprises an optical element, a holding frame and an adhesive for fixing the optical element to the holding frame. The adhesive comprises an ultraviolet curing type adhesive containing 0.5-20% by weight of a filler.
