The invention is directed to a thick film paste composition comprising electrically conductive particles and finely divided particles of a glass composition comprising by mole % 5-70% Bi.sub.2 O.sub.3, 18-35% SiO.sub.2, 0.1-40% CuO, 0.5-25% ZnO, 0.5-40% CoO, 0.5-40% Fe.sub.2 O.sub.3, and 0.5-40% MnO, which the glass composition is free of lead and cadmium, all dispersed in an organic medium.
An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90.degree. or less as measured in a nitrogen atmosphere.
The present invention relates to a process for manufacturing recyclable black enamels that contain at least zinc, in which process glass forming materials comprising at least bismuth, silicon, boron and manganese are melted, at temperatures greater than about 900.degree. C., and then a glass frit comprising at least zinc is added to the mixture obtained after this direct melting. The invention also relates to zinc-based recyclable black enamel compositions.
The present invention relates to a process for manufacturing recyclable black enamels that contain at least zinc, in which process glass forming materials comprising at least bismuth, silicon, boron and manganese are melted, at temperatures greater than about 900.degree. C., and then a glass frit comprising at least zinc is added to the mixture obtained after this direct melting. The invention also relates to zinc-based recyclable black enamel compositions.
A pH adjusting agent is added to a conductive adhesive to prevent the dissolution of a conductive particle to improve the reliability of a mounting structure, wherein when a pH environment is produced in which the conductive particle is easy to dissolve in the surrounding of the conductive adhesive, the pH adjusting agent can change the pH environment to a pH environment in which the conductive particle is resistant to dissolving.
A nontoxic lead-free conductive paste comprising (a) a lead-free glass frit having a crystallization temperature of 700.degree.-870.degree. C. and consisting essentially of, by weight %, 20-38% of SiO.sub.2, 5.5-13.5% of B.sub.2 O.sub.3, 8-15.5% of Al.sub.2 O.sub.3, 4-19% of CaO, 20-29% of ZnO, 0-6% of ZrO.sub.2, 4-16% of TiO.sub.2 and 0.1-3.8% of MoO.sub.3 ; (b) finely divided particles of electrically conductive material; (c) at least one inorganic additive selected from the group consisting of bismuth oxide, zinc oxide-containing containing oxide material, manganese oxide, copper oxide and molybdenum oxide; and (d) an organic medium. The nontoxic conductive paste is free from environmental and health problems and results in conductors having excellent solderability, solder leach resistance, adhesion strength and electrical properties, both on ceramic substrates such as alumina or on dielectric bodies.
