An apparatus through which a substrate may be transferred between a first chamber and a second chamber in which the first chamber is maintained at a high temperature relative to the ambient temperature of the second chamber. The apparatus comprises a passageway for receiving the substrate and a thermally isolating interface. The thermally isolating interface reduces heat transfer from the first chamber to the second chamber and allows for transfer of the substrate between the apparatus and the second chamber. The thermally isolating interface includes a hole having dimensions such that the substrate is transferrable through the thermally isolating interface.
This application is a continuation of U.S. patent application Ser. No. 09/891,784 filed Jun. 25, 2001 now abandoned, which is hereby incorporated by reference herein in its entirety.
