An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. The apparatus for planarizing a workpiece may include first and second polishing surfaces where the first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus may also have a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface. An apparatus for planarizing a workpiece which includes a plurality of polishing stations is also disclosed. At least one of the polishing stations has a web with a first face which is positioned adjacent the workpiece during planarization . The apparatus also includes an orbiting assembly configured to orbit the web relative to the workpiece.
CROSS REFERENCE TO RELATED APPLICATIONS
This is a divisional application of and claims priority to U.S. Non-Provisional application Ser. No. 09/705,307, entitled "Orbiting Indexable Belt Polishing Station for Chemical Mechanical Polishing", filed on Nov. 3, 2000, Now U.S. Pat. No. 6,793,565, which application is incorporated herein by reference.
