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Plasma enhanced pulsed layer deposition



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Patent 7361387
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Document Number
US Patent 7361387
Issued Date
April 22, 2008
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Abstract
A process system and a deposition method for depositing a highly controlled layered film on a workpiece is disclosed. The basic component of the apparatus is a pulsing plasma source that is capable of either exciting or not-exciting a first precursor. The pulsing plasma source includes an energy source to generate a plasma, and a plasma adjusting system to cause the plasma to either excite or not-excite a precursor. The precursor could flow continuously (an aspect totally new to ALD), or intermittently (or pulsing, standard ALD operation process). The deposition method includes the steps of pulsing the plasma to excite/not-excite the precursors and the ambient to deposit and modify the deposited layers. This procedure then can be repeated until the film reaches the desired thickness.
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Number of Claims:
12
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Owner
Tegal Corporation (Petaluma, CA)
Published
April 22, 2008
Application Number
10/744,889
Filed
December 23, 2003
US Classification
427/569   257/E21.171 427/535 427/571 427/575 427/576
Int'l Classification
H05H   1/46   (20060101)   B05D   3/06   (20060101)   C23C   16/02   (20060101)   C23C   16/44   (20060101)   C23C   16/50   (20060101)   C23C   16/511   (20060101)   C23C   16/56   (20060101)  
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Parent Case
This application is a divisional of Ser. No. 09/721,162, filed Nov. 22, 2000, now U.S. Pat. No. 6,689,220.
USPTO Field of Search
427/488   427/534   427/535   427/562   427/569   427/573   438/788   438/792   438/771   438/772   438/776   438/777   438/761  
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