The invention is directed to a chip comprising a substrate having a plurality of pads located thereon and a passivation layer located over the substrate, wherein the passivation layer has a plurality of openings and recesses formed therein and the openings expose the pads respectively. During the later performed packaging process, a molding compound can fill out the recesses on the passivation layer to provide a stronger mechanical adhesion between the molding compound and the passivation layer. Therefore, the peeling issue of the molding compound can be solved.
