A leadless plastic chip carrier is fabricated by selectively etching a leadframe strip to reduce a thickness of the strip at a portion thereof. Selectively masking the surface of the leadframe strip using a mask, follows selectively etching, to provide exposed areas of the surface at the portion and contact pad areas on leadframe the strip. At least one layer of metal is deposited on the exposed areas to define a die attach pad on the portion of the leadframe strip with reduced thickness and to ...

The present invention relates to an apparatus and method for isolating a wellbore condition such as formation pressure during a wellbore operation. The invention has particular application in connection with underbalanced drilling. In one arrangement, a formation isolation apparatus is provided that serves as a selectively actuatable plug. The plug in one aspect is selectively set and released by a setting/releasing tool. The setting/releasing tool includes a system for setting the plug in the w...

A self-propelled road milling machine is equipped with a cooling system comprising a fan for drawing in air, a cooler, and a suction channel. The suction channel has a vent opening facing the cooler and an intake opening. In relation to the longitudinal axis of the road milling machine, the intake opening points to the side of the road milling machine, so that air is drawn in from the side. This results in significantly less dirt being sucked into the machine than when the suction channel is pos...

A multi-layer lamination is formed from a core sandwiched between a first oriented plastic layer and a second oriented plastic layer. The orientations of the plastic layers cross at an angle between but not equal to zero degrees and 180 degrees relative to one another. A method for making the lamination is also disclosed.

A method for making a semiconductor device includes mounting a die on a die-mounting substrate, providing an interposer on the substrate, forming a conductive strip that is laid on the interposer and that is electrically connected to a bonding pad of the die and to a contact of the substrate, forming an encapsulant layer on the interposer, and forming a solder bump that is electrically connected to the conductive strip and protrudes outwardly from the encapsulant layer.

A hermetic package for electronic components which is made of metallic silicon is disclosed. The package creates a cavity for receiving the electronic component, preferably a piezoelectric device, which provides a evacuated environment in the range of 1.times.10.sup.-5 to 1.times.10.sup.-11 torr. In a first embodiment, the single crystal metallic silicon is p-doped to make it electrically conductive, obviating the need for lead wires which could compromise the hermeticity of the package. Silicon...

Embodiments of methods, apparatuses, devices, and/or systems for determining matter properties are described.

The present invention relates to device for attaching at least one slat of a slatted base to a frame of the slatted base, the device comprising a first member (2) arranged to be attached to the inner side of the frame of the slatted base and comprising first connecting means (5'); a second member (1) comprising a top portion (1'') arranged to engage an extremity of at least one slat of the slatted base, a base portion (1') connected to the top portion by means of at least one resilient member (4...

A downdraft boiler has a ceramic burner plate overlying a horizontal-tube heat exchanger at least the upper tubes of which each have an internal turbulator preventing premature vaporization of the water traversing the heat exchanger. The turbulator can consist of a twisted metal strip whose edges lie along helices.

Various embodiments of an apparatus and method for dispensing elongated material, such as tape, from a spool of such material are disclosed. In one embodiment, a dispenser includes a rotatable spindle for supporting a first spool of material and a feedback mechanism for providing a controlled braking force to the spindle in response to changes in tension in the material being dispensed. The dispenser also can include another spindle for supporting a second spool of material. The trailing end por...