A holding mode is selectively switched, in accordance with the content of processing of a substrate, among three holding modes: (a) a first holding mode in which while first support pins F1 through F12 abut on the back surface of a substrate W and support the substrate W, the substrate W is held because of nitrogen gas which is supplied to the front surface of the substrate W; (b) a second holding mode in which while second support pins S1 through S12 abut on the edge surface of the substrate W ...

To facilitate handling of a wafer in processing or carrying of the wafer after the wafer has been reduced in thickness by grinding, the whole back of a wafer is ground to provide the wafer with a predetermined thickness. The wafer surface includes a device region, with a plurality of devices formed therein, and a peripheral surplus region enclosing the device region. After grinding of the whole back surface, a region of the back surface corresponding to the device region on the wafer surface is ...

The invention relates to a method of manufacturing a surgical instrument having a rotatable shaft 2 and a working part 1 disposed thereon, the working part having at least one cutting edge, wherein the shaft 2 and the working part 1 are made of oxide ceramics, characterized in that for the manufacturing of the contour of the instrument, a rough grinding using a grinding tool having a grain size between 40 .mu.m and 110 .mu.m is performed, and subsequently, a fine grinding of the cutting edges us...

The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208) form the three-dimensional network of interconnected unit cells (225). The polishing element...

A mounting system for rotating tools such as grinding wheels in a hand-held power tool, includes a hub mountable to the tool drive shaft and a rotating tool element removably affixable to the hub. The tool has at least one flange that engages a corresponding circumferential groove in a hub wall. Both the hub and tool have complimentary lock elements to frictionally retain the tool in a releasably fixed orientation upon the hub. One of the lock elements is in the form of a depression, while a mat...

A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of the polishing pad. In the dresser, at least three polish retainers having band-like shapes are formed and elongated in radial directions from substantially the center of the support surface so as to form a plurality of sectorial re...

A work having a portion to be ground, such as a tapered surface, is ground by a grinder driven by a driving device. During grinding operation, coolant is supplied to a grinding surface of the grinder and the portion to be ground. After the grinding operation is completed, the coolant is continued to be supplied for removing sludge on the grinder while the grinder is leaving the work and returning to its original position. The coolant may be pressurized to a higher level when it is supplied for r...

This apparatus includes a unit for adhering an elastic seal to a lens holder, a unit for causing the lens holder, to which the elastic seal is adhered, to hold a lens, a pivotal arm, an arm driving unit for pivoting the pivotal arm, a clamp unit attached to the pivotal arm to be vertically movable to hold the lens holder, and a clamp driving unit for vertically moving the clamp unit. The pivotal arm is pivoted to sequentially adhere the elastic seal to the lens holder and hold the lens by the le...

A method of producing silicon blocks by cutting a silicon ingot is provided. The method uses a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the silicon blocks that can be produced into silicon wafers each having a thin thickness with reduced substrate damage at the time of producing a solar battery. The alkaline substance has a content mass that is at least 3.5% with respect to the mass of the entire liquid components of said slurry, and the ...

An electric grinding gun has a body, a gear reduction device, a holding cap, and an actuating device. The body has a casing, a rechargeable battery, a protective circuit board, a switch, a trigger, a motor, a cooling fin and a mounting barrel. The gear reduction device is rotatably mounted in the mounting barrel and has a seat, two planet gears and a gear ring. The seat is rotatably mounted in the mounting barrel and has a shaft hole, two gear recesses and a connecting axle. The holding cap is s...