A thermocouple device adapted to regenerate its junction in an ablating environment. The device includes a pair of dissimilar ribbon-like members the ends of which are welded or otherwise secured together. The individual members are folded on themselves in side-by-side non-contacting relation to provide a thermocouple assembly. The assembly--in turn--is imbedded in an ablating or like material. So positioned, ends of the members will reweld themselves as the ablating material melts away. The abo...

An electroluminescent diode which includes an electromagnetic radiation emitting PN junction formed by diffusing, into both surfaces of a semiconductor slice of a first conductivity, a dopant material of opposite type conductivity. Contact metallizations are mounted within windows in an insulating barrier which covers said diode so as to form electrical contacts engaging both the N and P type areas of the diode. An annular reflector metallization pad is mounted on the surface of the device over ...

A semiconductor device having platinum dispersed throughout said device. The dispersion of platinum within a semiconductor device results in improved electrical characteristics of the device. In a silicon diode, the improved characteristics include the reduction of reverse recovery time and an increase in the breakdown voltage. In a silicon transistor, the improved characteristics include the achievement of high switching speeds while maintaining high forward current gain.

Disclosed are methods for aperturing thin members by photochemical masking, exposing and etching techniques, such thin members may be a thin film of insulating material deposited or formed on a semiconductor substrate, or they may be a thin sheet or layer of material, such as metal.

In a piezoelectric transformer comprising a ceramic body in the form of an elongate plate of piezoelectric material with one half polarized in the direction of thickness and the remaining half in the longitudinal direction, a pair of input electrodes secured to the opposite sides of said one half and an output electrode secured to the end surface of the remaining half, there is provided supporting means including means for mechanically clamping and supporting the piezoelectric transformer at at ...

A device is formed in a semiconductor body having a major surface, with an insulating coating over the surface having an aperture exposing a portion thereof. A polycrystalline semiconductor layer is disposed in the aperture and over the coating, and a refractory metal layer overlies a portion of the semiconductor layer. A metal layer having low temperature properties overlies another portion of the semiconductor layer and is spaced from the refractory layer by a third portion of the semiconducto...

A film of an insulating compound is formed by evaporating the individual elements from separate sources while maintaining the substrate at a temperature in the range in which neither element will deposit if evaporated alone. A baffle disposed between the sources and the substrate prevents other than vaporized material from reaching the substrate. The film is very pure, may be highly oriented when formed on a suitable substrate, and is particularly useful for its piezoelectric properties.

Compliant bonding of beam-lead devices such as integrated circuit chips is accomplished by engaging successive ones of the chips with successive portions of an apertured strip of a compliant bonding medium and bonding the chips to successive portions of substrates. A bonding head travels along a bonding axis both to pick up a chip from a tray and later to bond the chip to a substrate. After each bonding stroke a spent portion of the strip is removed from the bonding axis and a fresh portion is i...

Information-storing devices, such as read-only-memories, comprise an array of semiconductor components on a substrate, each component being connected into the array by a fusible element. To disconnect selected ones of the components from the array, to store information, two sources of heat are applied to the fusible elements connected to the selected components to open-circuit the elements. One of the sources comprises the passage of current through the selected elements. The other comprises a g...

Means are provided to remove an assembly comprising a frame, a chip and a substrate from the support on which they are assembled. That means comprises moveable fingers which are rotated out of frame contacting position by power means such as compressed air and which are rotated into the frame contacting position by springs.