
A silicon micro-transmitter chip is housed within top and bottom closures snap-fitted together by legs and catches on the two closures. The chip is mounted between two acoustic cavities in the closures by a plate part of a configured metal sheet having other strip parts extending through grooves in the bottom closure to its outside where the strips are bent to provide arms for surface mounting the entire device on a printed wiring board. The sheet serves both as a continuous strap for effecting ...











