An ultrasonic working apparatus including a booster horn defined by a coaxially aligned rod member and plate member. The rod member has one end thereof coupled to the vibrator by a rod coupler, and an opposite end portion coupled to one end of the plate member. The opposite end portion of the plate member is provided with a plurality of workpiece engaging lugs. The upper end of the plate member is substantially congruent with the lower end of the rod member. The plate member has a thickness at t...

In order to vibrate a capillary stably at an arbitrary frequency with an arbitrary waveform, a bonding apparatus having a piezoelectric element vibrating stably at an arbitrary frequency with an arbitrary waveform in response to an input of a piezoelectric element control signal from a piezoelectric element control signal generator is provided.

A low mounting impedance ultrasonic transducer for mounting on a bonding machine comprises a prior art type transducer having a modified mounting flange which includes one or more elongated apertures in the mounting flange or the transducer body to isolate transverse radial stress in the transducer body from entering into the mounting flanges and coupling to the bonding machine.

A versatile rigid horn assembly for distributing ultrasonic energy from at least one source to a plurality of spaced work areas is provided. This rigid horn assembly includes an elongated tool holder having an input region at one end and an output region at the other end. The tool holder is a horn of suitable metal and will have a length of at least one acoustical half wavelength, or any desired number of integral half wavelengths. Secured to and extending from the output end are rigid tool memb...

A replaceable welding tip for a vibratory high frequency welding apparatus comprises a sleeve having a plurality of ridges, each ridge including a workpiece engaging surface. The tip is clamp mounted by screw means to an antinodal region of the resonator which provides the vibratory energy to the tip. The axis of vibration of the workpiece engaging surfaces and that of the thread of the screw means are substantially parallel with each other.

A bonding apparatus including an ultrasonic horn that has a bonding tool, a horn support, which is for mounting the ultrasonic horn to a bonding arm of the bonding apparatus, and vibration-generating sources provided on both sides of the horn support. These vibration-generating sources are operated to generate vibrations by an ultrasonic oscillation device that operates the vibration-generating sources via separate outputs.

This invention is intended to reduce the size of a bonding apparatus and includes a first means which is to construct the bonding apparatus by swingably mounting a lifter arm 4 for holding a horn 2 to the upper Y table 9 of an X-Y table 10. The second means is to construct the apparatus by using the upper Y table of the X-Y table as a bottom plate of a bonding head, and the third means is that in addition to the second means, it is further arranged so that a linear motor 15 is fixed such that a ...

The present invention relates to a method of connecting an armature coil with a commutator segment which includes connecting the end portion of an armature coil by ultrasonic welding to the commutator segment which is arranged in the same direction as the axis of a shaft and is initially formed with a molded substrate, wherein said ultrasonic welding is performed while the commutator segment is fixed in place by a rigid pressing member. The present invention is suitable for connecting the armatu...

The following specification discloses a touchdown sensor for ultrasonic wire bonding devices. Such ultrasonic wire bonding devices are used for purposes of bonding wires to integrated circuits, package terminations, hybrids, and discrete semiconductor devices. The devices entail the utilization of a transducer that operates in a series resonant mode. The means of exciting the resonant mode is through an electrical signal imparted thereto, so that a tool attached to the transducer can then impart...

A wedge bond tool tip (20, 30, 50, 56) for bonding electronic interconnects to bonding pads of a semiconductor device enables fine-pitch non-orthogonal wire bonding. The tool tip (20, 30, 50, 56) has an overall width and a front face (12', 52) that has a reduced area which is narrower than the overall width. The reduction in the front face is accomplished through either chamfering or rounding of the corners to reduce the contact distance (42 and 44) between the wedge tool and a previously made a...