A method of polishing and coloring concrete surfaces using a dry concrete grinding process which includes locking in dye colors by applying the dye to the cementicious surface mid way during a series of grinding steps using sequentially finer grit, and then applying a sealer after the dye has dried and continuing the grinding process with sequentially finer polishing grits after the sealer has dried and hardened. A second coat of sealer is then applied at the end of the grinding process. In a pr...

A method of manufacturing a ferrule assembly. The method including first and second polishing operations. The first polishing operation including polishing only the end face of a ferrule of an assembly. The second polishing operation including polishing only the optical fiber of the assembly.

A wafer substrate is polished by disposing the wafer substrate between an abrasive cloth on a polishing platen and a plate, and relatively rotating the polishing platen and the plate for mirror polishing the surface of the wafer substrate with the abrasive cloth. A liquid is fed onto the plate side surface of the wafer substrate so that the wafer substrate is directly held to the plate by the adsorption force of the liquid, while performing the mirror polishing.

To prolong the useful life of a diamond guide element which serves to guide a transducer and which is provided with a contact surface via which the element in use bears against the surface of a record carrier while the carrier moves relative to the element, the element is constructed so that the direction of such relative movement corresponds to a high wear resistance direction of the diamond, and the contact surface thereof is periodically ground in an opposite direction in which it has a lower...

A glass workpiece is polished to obtain a surface having a high luster and a substantial absence of polishing defects by applying to the surface a slurry of a glass powder of substantially the same hardness and composition as the workpiece and a liquid carrier. The slurry also contains a buffering agent which stabilizes its pH between 8 and 12 and preferably between 10 and 11. Its specific gravity preferably lies between 1.14 and 1.19. A rotating polishing pad made of a synthetic fiber is then p...

A method of drilling holes in glass wherein a drill is rotated at a speed between about 3,400 rpm and about 3,600 rpm and advanced into a glass work piece at a constant forward rate of speed.

A method for preparing oxide piezoelectric material wafers from a rhombohedral single crystal of an oxide piezoelectric material as-grown cylindrically in the X-axis direction includes linearly rubbing-off at least one side portion of such as-grown cylindrical single crystal facing to a specified direction along the longitudinal direction of such single crystal before cutting X-cut wafers from such single crystal thereby to provide a corresponding flat portion.

A bobbin handling apparatus in which filled bobbins are stored in a storage-conveyor bin and discharged through a chute and into a hopper. The bin continues to feed bobbins until a predetermined weight of bobbins is in the hopper whereupon a control system stops operation of the bin and concurrently closes a closure associated with the chute to prevent any bobbins subsequently passing from the bin from entering the weighing hopper. Strands of yarn extending from the bobbins are severed by a cutt...

An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.

A carrier head for holding a workpiece during processing of a workpiece surface is provided. The carrier head includes a carrier housing, a base and a pressure member. The base is configured to hold the workpiece and is movable with respect to the carrier housing. The pressure member is between the base and the carrier housing and is configured to induce the base to apply a predetermined force onto the process surface.