
This disclosure describes a double-sided transmission substrate formed with striplines and end-ports in juxtaposition on either side. The transmission substrate is sandwiched between two exterior dielectric substrates, each coated on one side with a metallic layer. The three substrates are laminated together. Through-holes are drilled into the lamination and its interior substrate, at known locations to intersect the said ports. The copper exteriors of each board are etched to identify two conta...











