This invention relates to a foil having an adhesion promoting layer overlying at least one side of said foil. The adhesion promoting layer is suitable for enhancing adhesion between the foil and another substrate. The adhesion promoting layer is derived from a composition comprising silanes (A) and (B). Silane (A) is at least one compound represented by the formula ##STR1## wherein G.sup.1, G.sup.2, G.sup.3, G.sup.4, G.sup.5 and G.sup.6 are independently halogen, hydrocarbyloxy, or hydroxy group...

An improved system bus structure for versatile use in various digital computer architecture configurations, particularly those of mini-supercomputers, and, designed to support high speed, high reliability, parallel processing of bi-directional signal transfers in a multi-port and multiple central processor unit (CPU) communication environment as between system bus units or devices. The system bus structure may be sized for a compact encasement and may carry as many as 129 simultaneous signals to...

The present invention provides a method for producing high density electronic circuit boards comprising the steps of depositing a layer of a first metal upon a layer of foil to produce a composite then attaching the composite to an insulative support to produce a laminate. The layer of foil is then removed from the layer of first metal. Photoresist is then applied to the layer of first metal, exposed and developed. During the development of the photoresist portions of the photoresist are removed...

Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities and/or to modify the ductility characteristics of the foil.

A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering at least one side of the foil with a sheet of plastic film. The film is removably joined with the foil as a result of the essential absence of gaseous material between the film and the foil. Thus, the film conforms intimately to the contours and shape of the foil surface and clings tightly thereto to permit movement and further processing of th...

A fusible element component for use in an electrical fuse, the component including a substrate made of insulative material and having a substrate surface, a fusible element made of a thin film of conductive material that is supported on the substrate, overlies a fusible element support area of the substrate surface, and provides a conductive path during normal current conditions, and a resistance element of resistance element material that is supported on the substrate, overlies a resistance ele...

Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities, and/or to modify the tensile strength and ductility characteristics of the foil. An IPC Class 2 foil is prepared without annealing.

In a high-voltage output buffer, a self-adjusting bias generator is provided which is capable of automatically adjusting the applied bias voltages in the output buffer so as to enhance the output buffer performance. Under normal or high supply voltage conditions, the bias generator provides a first set of bias voltages to the series-connected transistors in the output buffer. Under low supply voltage conditions, the bias generator provides a second set of bias voltages to the various series-conn...

An applicator for applying resin to fibers being braided in a tubular shape (e.g., in the manufacture of a fuse casing), the applicator having a wiping surface on which the fibers wipe as they travel to a mandrel on which they are braided, the wiping surface being defined by a surface of revolution around the mandrel and having a continuous orifice for supplying resin continuously around the wiping surface. Also disclosed is an electrical fuse including a fuse casing having a tubular wall includ...

A highly stable high-voltage output buffer is provided which may be manufactured using standard CMOS technology. As part of the invention, the effects of voltage drift at one or more of the nodes formed between series connected P or N-channel MOSFET devices are generally reduced or eliminated. The present invention includes compensation circuitry which reduces the effects of parasitic coupling within the MOSFET devices, and which serves to compensate for any voltage drift which may occur at the ...