In an optical storage system where an information bearing surface moves relative to a read/write head the latter includes a transparent body in which light beams sent to and from the surface are guided by multiple internal reflections. Beam shaping and focussing is effected by optical elements integrated in the surface of the body at the locations where the internal reflections occur. A distortion free imaging system is obtained with two series-arranged aspheric reflection surfaces which focus t...

The invention relates to a muffler which includes a first expansion chamber, a second expansion chamber, a resonator chamber, and an inlet pipe having a first open end and a second open end. The first open end of the inlet pipe is inserted into the first expansion chamber so as to communicate with the latter. A resonator pipe runs substantially in a coaxial relationship with the inlet pipe so as to establish communication between the first expansion chamber and the resonant chamber. A return pip...

The magnetic data storage system includes a magnetic transducer head-suspension assembly with an inline suspension slider with a reduced height leading portion that provides for gimballed connection to the suspension load beam and a full height rear portion that enables the use of the increased height portion for the transducer coil windings. The suspension includes a single piece combined gram form and load beam with the entire head-suspension assembly being contained within the height of the s...

A channel subsystem with a conventional serial extender link that causes communications between a channel and a control unit to be delayed by the additional time to transmit a message in one direction and to transmit an acknowledgement in the other direction. The channel subsystem also has a buffer and associated components (called a channel outboard box) that are used for prefetching data from processor memory or from a peripheral device without waiting for the acknowledgment routines that are ...

An electronic component is formed by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomer is selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof.

A character compaction and generation method and apparatus which is particularly adapted to the compaction and generation of complex characters such as Kanji characters. Each character in a complex character set is defined by an I row and J column dot matrix, wherein each row is comprised of J bytes. Each successive row of a given character is scanned from the first through the Jth byte to determine if the current byte being scanned has the same numerical value as the immediately preceding or di...

A recovery mechanism restarts jobs following correction of a system failure and automatically marks the jobs for interruption at a logical boundary. The logical boundary is above logical file updating functions such that logical files are in a known state when jobs reach the boundary. When a system failure is detected which has not yet resulted in lost data, an image of working memory, including hardware status is saved on nonvolatile storage. After the failure has been resolved, the system is i...

Esters of 1-oxo-2-diazo-naphthalene sulfonic acid wherein the sulfonic acid group is at either the 4 or the 5 position of a hydroxymethyl-tricyclo [5.2.1.0.sup.2,6 ] decane wherein the hydroxy group is either at the 3 or 4 position and useful as sensitizers for positive resists, particularly relatively thick resists at 365 nm.

A method for passivating the surface of a compound semiconductor comprises annealing the substrate to form an anion rich surface layer containing cationic and anionic oxides and stripping the oxides to leave only a very thin anionic layer on the surface. The substrate is then subjected to an H.sub.2 plasma cleaning to remove chemisorbed oxygen. An N.sub.2 plasma cleaning is then performed to form an anionic nitride layer that is free of any cationic nitride. A layer of insulating material, such ...

An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i.e., silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i.e., thin film copper of approximately 5 microns), semiconductor integrated circuit chips connected to the upper-most patterned conductive layer, and means to connected the packaging structure to the next level of packaging (i.e...