Provided herein is a process of fractionating ferroelectric, preferably vinylidene fluoride polymers using a solvent having at least one polarizable functional group, and a precipitant. The composition of the fractionated ferroelectric polymers is selected so as to adjust the properties of a ferroelectric film made from the polymers. Films formed using the fractionated vinylidene fluoride polymers have improved properties, particularly with respect to roughness and crystal domain size, and suita...

A method of preparing Group VA organometal compounds in high yield and high purity by the reaction of a Grignard reagent with a Group VA metal halide in certain ethereal solvents is provided. A method of preparing Group VA organometal hydrides is also provided.

A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-depositi...

Photoresists of the invention contain an added acid reaction component together with one or more resins and a photoactive component. Preferred photoresists of the invention can provide processes substrates such as microelectronic wafers with desired iso-dense bias values. Particularly preferred photoresists of the invention are chemically-amplified positive-acting resists and contain an ester-based solvent such as ethyl lactate or propylene glycol methyl ether acetate in addition to the acid rea...

Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

Organometallic compounds containing a phosphoamidinate ligand are provided. Such compounds are particularly suitable for use as vapor deposition precursors. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds.

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like.

Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a pla...

A method of purifying an organometallic compound by heating the organometallic compound in the presence of a trialkyl aluminum compound and a catalyst.