A method and apparatus that couple a change input scan chain test pattern with an initialization scan chain test pattern such that a resultant scan chain test pattern is produced, and apply the resultant scan chain test pattern to at least one combinational logic path. In one embodiment, the coupling is achieved by interleaving the change input scan chain test pattern with the initialization scan chain test pattern. In another embodiment, the coupling is achieved by creating a constructed test p...

Described herein is an apparatus for producing three-dimensional staic or moving images. In one embodiment, the apparatus includes an image generator and an optical device. The image generator generates a plurality of image elements including first and second image elements. In one embodiment the image elements constitute coherent beams of light encoded with image information, wherein the coherent beams of light are sequentially generated by one or more laser scanners of the image generator. The...

A memory system having a main memory which is coupled to a plurality of parallel virtual access channels. Each of the virtual access channels provides a set of memory access resources for controlling the main memory. These memory access resources include cache resources (including cache chaining), burst mode operation control and precharge operation control. A plurality of the virtual access channels are cacheable virtual access channels, each of which includes a channel row cache memory for sto...

An EMI cable passthrough shield for a cable opening in an electronic system housing. The EMI cable passthrough shield includes portions made of an electrically conductive, deformable material having cable passageways to receive cable. A plurality of shields can be stacked in a cable opening of an electronic system housing. The shields can be compressed such that the deformable material completely encloses a cable. An example of a deformable electrically conductive material is an electrically con...

An automatic and parameterized compute implemented method for transposing wires in an integrated circuit design can y bus lines with similar impedances, and therefore similar signal transmission characteristics. Using a specially designed CAD tool, a user can specify a transposing porn, intervals at which to transpose wires, and a metal layer through which to accomplish the transposing in the integrated circuit. Using a routing database the tool then automatically determines the locations in the...

A method and system for use in wafer fabrication systems. The method and system capture an evolving wafer fabrication system by mapping at least one interaction between a selected at least one integral part associated with the wafer fabrication system and at least one other integral part associated with the wafer fabrication system.

An apparatus provides storage for cable slack and also provides for segregation of interface cables on the front of a chassis and for segregation of intrasystem cables on the back of the chassis. A and B copies of intrasystem cables are segregated on opposite sides of the chassis. Cable slack spools are provided at the top and bottom, on each side of the front and rear surfaces. This configuration allows for convenient cable slack storage for both top-entry and bottom-entry cables.

Services are provided in an architecture utilizing a framework of standardized interconnection mechanisms that allow for the dynamic addition of new services that meet rules for the distributed services network. Likewise, new agents may readily be added to the network. The network architecture is composed of agent software at the broadband subscriber endpoint in conversation with server software at the service provider location. Under the present architecture, certain minimum service functionali...

Provided is a test wafer and a process for making the same that includes a plurality of peaks on a surface thereof that have a cross-section sufficient to reduce the stress of a refractory metal layer deposited thereon. The present invention is based upon the discovery that by fracturing a refractory metal layer on a test wafer reduces the stress to which the test wafer is subjected. The test includes a substrate having a surface with a plurality of peaks and troughs formed therein defining a ro...

A phase adjustment circuit has a signal path having a plurality of phase adjustment elements coupled together. Each of the phase adjustment elements of the plurality has a first path and a second path. The second path of each of the phase adjustment elements of the plurality adds a smaller amount of phase adjustment to the signal path than the first path of each of the phase adjustment elements of the plurality. The amount of phase adjustment added by each of the phase adjustment elements of the...