This is an interconnection between electronic devices and other assemblies (e.g. printed circuits). The electronic devices are mounted on high temperature insulating bases, such as ceramic substrates. The insulating base has a conductive pattern to connect the electronic device to another assembly. The conductive pattern terminates in metal bumps capable of being connected to another assembly (e.g. a printed circuit) by a conductive adhesive or metallurgically by soldering, thermocompression, th...

A method of forming bumped substrates with protuberances for inverted or flip-connection bonding of electronic devices including semiconductor devices, integrated circuits, and/or application specific integrated circuits and electromechanical devices. The substrates are high temperature insulating materials provided with a conductive pattern. The conductive pattern has contact areas corresponding to the input/output (I/O) pads of the electronic device. A metal is applied over the contact areas, ...

This invention is a simplified method of digitally monitoring energy in a system. The power is measured at fixed periods, and the measurements summed in a register or accumulator. When the sum in the register or accumulator is equal to a specified energy divided by the fixed sample period a signal is generated.In power controllers or solid state power controllers (SSPC), this algorithm is used to the maximum energy load (I.sup.2t). In a solid state switch, this algorithm is used to monitor the e...

Apparatus for transporting and processing documents and maintaining a preset nominal inter-document gap, g.sub.nom therebetween, this apparatus including a transport stage for picking each document from an input stack and advancing it toward a destination at a controlled rate; a sensor unit for sensing the distance g between the so-moved document and the following document; and a control stage for determining the variance .gradient.g, between g.sub.nom and g, while driving each successive docume...

Arrangement for lifting image of checks, with Xenon lamp, Fluorescent lamp or like source of stable-wavelength-output and CCPD Camera means selected to exhibit "close-to-human" spectral response plus a photopic filter, disposed upstream of the Camera and adapted to shift its received image-light spectrum in the direction of that which is optimal for the human-eye.

A linear actuator for reciprocating a read/write head mechanism relative to a magnetic disk storage system, including a second, supplemental solenoid coil and associated magnet pole in addition to the usual arrangement, by way of improving linearity and efficiency. A low reluctance end cap connects the magnet poles to a central coke.

A connector is disclosed for coupling pins on a printed circuit board to respective mating pins on a gate-array or like plug-in device; the connector is characterized by "floating ring" engagers based within, and adapted to resiliently couple a pair of such mating pins.

A technique and associated arrangement for detecting loss of phase/frequency lock in a phase lock loop, particularly for a magnetic disk drive servo system the phase lock loop detects timing asynchronism and loss of lock.

An electronic packaging module for inverted bonding of electronic devicss including semiconductor devices, integrated circuits, application specific integrated circuits, electomechanical devices and MEMS is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of electronic devices. The input/output pads of the devices may be simultaneously bonded to the protuberances...

A method of forming bumped substrates with protuberances for inverted or flip-connection bonding of electronic devices including semiconductor devices, integrated circuits, and/or application specific integrated circuits and electromechanical devices. The substrates are high temperature insulating materials provided with a conductive pattern. The conductive pattern has contact areas corresponding to the input/output (I/O) pads of the electronic device. A metal is applied over the contact areas, ...