
Described is a method for conforming electronics to arbitrary shapes. The method comprises acts of forming a device structure to have a growth substrate, an etch stop layer affixed with the growth substrate, and a micro-electronic array. The micro-electronic array comprises a plurality of components atop the etch stop layer. The micro-electronic array is thereafter embedded into a shrinkable layer. The shrinkable layer is then mounted onto a handle wafer that includes a layer of adhering film wi...











