A flow control valve is used with a hydraulic cylinder having a reciprocable piston and a rod connected thereto. The valve includes a valving spool which defines a relatively stable center position blocking off hydraulic fluid flow to the rod end of the cylinder, but not interfering with the flow to the head end of the cylinder. Upon application of pressurized hydraulic fluid to the valve through a line connected to the valve, the valving spool shifts in one direction to allow fluid flow to the ...

A metal edge seal ring is formed in a trench made up of a large number of short, connected legs in perpendicular relation. Metal is deposited in the trench, and because the metal is comprised of many short segments rather than several long, straight sections, the subsequent chemical-mechanical polishing step does not cause significant cupping of the metal in the trench.

Barrier structures are included within the packaging material of a packaged semiconductor device, such barrier structures including barrier bodies which overlie the die-die pad assembly of the device on either side thereof. The barrier bodies act as baffles which limit diffusion of moisture through the packaging material into the area of the die-die pad assembly of the device, the barrier bodies including apertures therethrough which control such diffusion in a manner that avoids delamination pr...

A method for making frontside contact to a substrate through an SOI structure thereon is provided. An etching step is undertaken to form a trench in the SOI structure so as to expose and define a rough surface of the substrate. Then, a thin insulating layer, for example SiO.sub.2, is formed over the exposed surface of the substrate, this insulating layer being irregular because of its formation over the relatively rough etched surface. Contact material is provided in the trench, and electrical p...

A tool is provided herein for separating stacked strips of semiconductor structures held by a magazine, which strips have become attached together. The tool is made up of first and second elongated members in side-by-side relation, each member defining a plurality of teeth along an edge thereof. The first and second members are mounted together so as to allow relative reciprocal movement therebetween, so that relative reciprocal movement between the pluralities of teeth is provided. The tool is ...

In the manufacture of an EPROM or EEPROM semiconductor device that includes a core region and a peripheral region, a nitride layer is formed over the core region and peripheral region, and an oxide layer is formed over the nitride layer. A layer of photoresist is provided over the oxide layer and is patterned to expose a portion of the oxide layer overlying the core region. A wet etch step is undertaken to remove the exposed portion of the oxide layer, using the patterned photoresist as a mask, ...

A dielectric layer has an opening which communicates with a metal line therebeneath. A layer of silver is deposited over the structure and into the opening, and copper is deposited by electroplating in the opening. An additional silver layer is the deposited, and an anneal step is undertaken so that the copper is surrounded or encapsulated by alloy containing copper and silver. After removal of appropriate portions of the silver layers, the copper remains encapsulated or encased by copper-silver...

In the testing of one or more die as part of a semiconductor wafer, electrical testing of an unstressed die of a wafer is undertaken. The die of the wafer is then physically stressed to a first stressed state, and electrical testing is undertaken thereon. The die of the wafer is then physically stressed to a second stressed state, and electrical testing is again undertaken on the die as it is in its second stressed state. The results of the tests are compared and extrapolated to indicate electri...

A soft magnetic alloy film has a composition formula expressed by Fex Mz Cw. M is at least one metallic element selected from a group consisting of Ti, Zr, Hf, Nb, Ta, Mo or W, or a mixture of these metallic elements. The composition ratio of x, z and w satisfies the relation expressed by 50 atomic % .ltoreq.x.ltoreq.96 atomic %, 2 atomic % .ltoreq.z.ltoreq.30 atomic %, 0.5 atomic % .ltoreq.w.ltoreq.25 atomic %, and x+z+w=100. The metallic structure of the soft magnetic alloy film basically cons...

The present invention relates to a driving mechanism for an electronic part such as a switch, a variable resistor, etc., which can be remote-controlled, wherein an ultrasonic motor is used as a driving source for the electronic part. Therefore the object thereof is to provide a driving mechanism for an electronic part, which produces no electromagnetic noise and for which the construction can be simplified by omitting a converting mechanism and a controlling mechanism.