A semiconductor structure having an improved polysilicon layer is formed. After the formation of a silicon dioxide layer over a semiconductor wafer, the semiconductor wafer is heated in an ambient comprised of nitrogen. The heating is preferably accomplished so that nitridation of the silicon dioxide does not take place. Subsequently, a polysilicon layer is formed on the silicon dioxide layer. The polysilicon layer is denser and thus more resistant to hydrogen fluoride than polysilicon formed wi...

A gettering process for semiconductor manufacturing is disclosed. The gettering process is performed after device formation and after a protective layer such as (BPSG) or (PSG) has been applied to the front side of a semiconductor wafer. The gettering process includes thinning and roughening a backside of the wafer using chemical mechanical planarization (CMP). During the (CMP) dislocations are formed which function as a trap of mobile contaminants. Additionally a gettering agent such as phospho...

A method of forming a isolation region in a semiconductor device includes the steps of forming an underlying oxide film on a semiconductor substrate, forming a first polysilicon layer on the underlying oxide film, forming a silicon nitride film on the first polysilicon layer, patterning the silicon nitride film such that the silicon nitride film is left only on a circuit element region of the substrate at which a circuit element is to be formed, depositing selectively a second polysilicon layer ...

A method of fabricating a semiconductor integrated circuit comprises the steps of selectively forming a first gate insulating film on a main surface of a semiconductor substrate. Thereafter, the following layers are formed in sequence on the substrate: a first polysilicon layer, a second gate insulating film, and a second polysilicon layer. Then, insulating trenches are formed by selectively removing the second polysilicon layer, the second gate insulating film, the first polysilicon layer, the ...

A very thin silicon film SOI device can be made utilizing a bond and etch-back process. In the presently claimed invention, boron dopant is introduced into a surface of a silicon device wafer and the doped surface is bonded onto another silicon wafer at an oxide surface. The device wafer is thinned by etching down to the doped region and, by subsequent annealing in hydrogen, boron is diffused out of the silicon surface layer to produce very thin SOI films.

A semiconductor circuit structure including a semiconductor substrate portion and at least one region provided on one main surface thereof insulatedly isolated from other regions provided on the same surface, by an burying means made of an oxide film, the burying means including a bottom flat portion and at least one side wall portion provided at least in the vicinity of an edge portion of and integrally formed with the bottom flat portion, thereby a semiconductor circuit structure provided with...

A method for manufacturing a DRAM cell is provided having an isolation merged trench for applying to 16 megabit and 64 megabit DRAM cells, which includes the steps forming a primary dielectric for a capacitor within the interior of a trench, depositing an n.sup.+ doped polysilicon, forming a secondary dielectric and then stacking polysilicon thereon and connecting the polysilicon within an n.sup.+ diffusion layer of the bottom of the trench for forming a plate. As a result of this method all of ...

A new method to produce a microminiturized capacitor having a regular microscopic ripple surface electrode is achieved by depositing a first polysilicon layer over a suitable insulating base. A resist layer is formed over the first polysilicon layer. The resist layer is exposed through a mask having a pattern of regular spaced openings in the areas of the planned capacitor to radiant energy in sufficient quantity to under expose, out of focus expose or a combination of under expose and out of fo...

A method for forming a crystalline film comprises respectively introducing into a film forming space having a substrate arranged therein a gaseous starting material for formation of the crystalline film and a gaseous halogenic oxidizing agent capable of chemically reacting with the starting material to form the film, the substrate having a surface comprised of a non-single crystal material having a predetermined temperature distribution.

The surface area of a junction-isolated tub in a silicon epitaxial layer grown on a silicon substrate is increased by introducing dopant into surface portions of the tub to effectively push back the junction between the tub and the isolation region. The junction-isolation region surrounding the tub typically has a dopant concentration profile which decreases from the center of the junction-isolation region towards the junction with the tub. By increasing the surface concentration of dopant in th...