A cover unit for hermetically sealing a container for a semiconductor device comprises a rectangular metallic cover element such as a cobalt-nickel-iron alloy and a plurality of contiguous turns of wire of a heat-fusible material such as a gold-tin eutectic alloy formed and disposed on the cover element with the outermost turn substantially in registry with the periphery thereof, said turns being spot-welded thereto substantially at the corners of the cover element. The preferred method of fabri...











