A grinding machine with a dust collector includes a driving portion, a transmitting portion, a dust-collecting tube, a fender, an air intake connector and a grinding wheel. The dust produced by the rotation of the grinding wheel is sucked by the dust-collecting tube having an inner tube. The inner tube is interconnected with an exhaust vent of the driving portion and the dust-discharging opening. An outlet of the inner tube is parallel to an airflow passage of the dust-discharging opening, such ...

A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.

A whetstone pellet 1 is composed of a columnar base body 2 to be fixed on a pedestal 9, and an abrasive grain part 5 containing numerous abrasive grains formed by electroless plating on an end surface 3 of the base body 2. Upon forming the abrasive grain part 5, a plated layer is formed on the end surface 3 of the base body 2 under stirring a plating solution containing abrasive grains, whereby the distribution of the abrasive grains in the abrasive grain part 5 can be uniformized.

A machining apparatus, comprising: a mounting member to be rotationally driven; a tool support member mounted on the mounting member; and a fixing member, fixed to the mounting member, for fixing the tool support member to the mounting member. The mounting member has a mounting outer peripheral surface of a generally cylindrical shape, a cylindrical mounting hole as a through-hole is formed in the tool support member, and the tool support member is mounted on the mounting member by fitting the m...

A portable water-driven rotary tool for drilling, grinding and polishing concrete and stone that provides for high torque and that uses water pressures as the power source, the tool including a water control valve, an impeller with blades and a drive shaft that has a longitudinal axial water passage disposed therethrough for diverting water used to power the tool onto a work surface for lubrication and as a cleaning agent.

The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into conta...

A diamond core drill bit (100) is disclosed. The drill bit has a right-circular cylindrical body (120) with at least one side lubrication hole (122) toward the bottom of the body and a plurality of parallel grooves (124) oriented in an axial direction at the bottom circumferential sidewall of the body. A cap (130) at the top of the cylindrical body (120) closes one end of the body. The cap has a central lubrication hole (134) and alternative embodiments have at least one core extraction hole (13...

A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity is coated to the compound material. The compound material has been used in printed circuit boards. The carrying device includes a plurality of tiny holes and a vacuum system located beneath the circular board. The thin wafer is attrac...

A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the ba...

An apparatus for cutting a material underwater is disclosed where the apparatus uses a mixture of abrasive material in a non-aspirated suspension mixed with a high pressure fluid, e.g. seawater. It is emphasized that. this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope ...