Apparatus including an oral syringe for attachment to a shower head for cleaning the teeth and gums while showering. The oral syringe is connected to water flowing under pressure to the shower head through a unique valving assembly which diverts a manually adjustable portion of the water flowing to the shower head into a passageway lying at right angles to the direction of the flow of the water into the shower head. A manually adjustable valve stem including an O-ring valve is located in the pas...

An orthopedic foot appliance of resilient plastic that has a heel portion, of varying angles, a front section and an intermediate section, said sections and portion being of varying thickness. The front section is longitudinal convex-concave at its top and bottom with a thin forwardly extending convex tip. The intermediate section is longitudinally planar substantially along its top and bottom. The heel portion at the bottom has a rearwardly converging horizontally planar intermediate section an...

Apparatus and methods for improving the safety and efficiency and decreasing the cost of producing liquid oxygen with a small-scale use liquefaction device, according to various embodiments of the present invention. In one embodiment, a switch is electrically coupled to a storage dewar pressurizing means, the switch positioned to be activated by a portable dewar upon engagement of portable dewar with storage dewar. Cryocooler and/or cooling fan enter low power mode when dewar liquid level reache...

A thin, light-weight flexible orthotic device which has a therapeutic portion and a non-therapeutic portion. The therapeutic portion is shaped and contoured to engage a human foot and consists of: a distal forefoot supporting region; a proximal heel supporting region; and a medial arch supporting region. The non-therapeutic portion is a cut-out segment positioned laterally to the therapeutic portion. The orthopedic device includes posting material therein which supports a user's foot and control...

The invention is a sole for footwear having an indentation for the ball of the heel and a heel stop under the rear of the arch to prevent the foot from sliding forward in the footwear.

A soldered assembly such as a packaged semiconductor chip includes elongated solder columns connected to the pads on the chip and a dielectric sheet having pads connected to the distal ends of the solder columns remote from the chip. Terminals on the sheet are connected to the pads of the sheet. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may cont...

An arch support for the foot includes a plantar support member having a cavity to removably receive a metatarsal support element; metatarsal support elements of different height can be used depending on the activity engaged in by the wearer; heel wedges of different height may similarly be used; the metatarsal support element has, in particular, an open lattice-like structure which reduces material and weight of the support, improves flexibility and allows better air circulation.

Metatarsal pad structured with relation to the foot for which it is intended so that it bridges across the width of the five metatarsal bones; a configuration at the front is such that each metatarsal is supported just posteriorly of the head thereof and with a height to raise the heads of the metatarsals from weight bearing and transfer of the weight over a larger area. The front of the pad is characterized by a radius of curvature of about 3/16 of an inch in the vertical plane and the frontal ...

A method and apparatus wherein two probes are arranged to oppose each other on either side of an object under investigation and each of two probes emits ultrasonic waves to measure the acoustic characteristics of the object respectively. Mean attenuation coefficients for small intervals can be calculated solely from the received echo signals by processing signals indicative of echos of the ultrasonic waves from the two probes. Reflection coefficients can be calculated from the mean attenuation c...

A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB.