In accordance with an embodiment of the invention, a Schottky diode includes a metal layer in contact with a semiconductor region to form a Schottky barrier therebetween. A first trench extends in the semiconductor region. The first trench includes at least one electrode or diode therein.

A low noise, high frequency solid state diode is provided from a plurality of unit diode cells which are interconnected in parallel. Each of the unit diode cells forms an element of an array having rows and columns of unit diode cells. The diode cells include a base region of polysilicon, forming an anode, and an active cathode region which forms a diode junction with the anode. A plurality of overlapping subcollector regions interconnect the cathode regions, to provide a single, continuous coll...

A diode is formed by forming a PN junction region 6 with a p region 5 formed on a buried oxide film 19 side and an n region 7 formed on the surface side in a surface silicon layer 3 which is isolated by the buried oxide film 19 of an SOI substrate 1, providing a lightly doped p region 33 on one end side of the PN junction region 6 and a lightly doped n region 31 on an other end side, forming a heavily doped p region 13 and a heavily doped n region 9 at the respective surface portions of the ligh...

A method of making ferro-lime wherein fine iron containing particles are injected onto the surface of the lime in a kiln, between the discharge end of the kiln and the flame and while the lime is at a high temperature to react instantaneously with the iron in the fines thereby to produce ferro-lime. Also disclosed is a method of recovering the fines from ferro-lime production wherein ferro lime fines are injected into the kiln onto the surface of the lime between the discharge end of the kiln an...

A pressure-operated, multiple-unit, diaphragm-valve is disclosed. Application or release of pilot-pressure to the valve actuates all of several diaphragm elements simultaneously thereby providing substantially instantaneous shutoff of fluid flow through a plurality of pipe lines. Other important features of the valve are its structural simplicity, speed of operation, and its modular construction.

A structure in a phase changeable memory cell can include a bottom electrode having an interlayer dielectric layer thereon, the bottom electrode can have a recess therein that extends beyond a boundary between the bottom electrode and the interlayer dielectric. A phase changeable layer can be formed in the recess and include a protruding potion of the phase changeable layer that protrudes into the bottom electrode beyond the boundary. Related methods are also disclosed.

An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage.

In one embodiment, the present invention relates to a method of forming a flash memory cell involving the steps of: forming a tunnel oxide on a substrate; forming an in situ phosphorus doped polysilicon layer over the tunnel oxide by low pressure chemical vapor deposition at a temperature between about 610.degree. C. and about 630.degree. C., wherein the in situ phosphorus doped polysilicon layer comprises from about 1.times.10.sup.19 atoms/cm.sup.3 to about 5.times.10.sup.19 atoms/cm.sup.3 of p...

Upon opening a tunnel window of an EEPROM having a floating gate, a portion of a conductive layer which serves as a floating gate electrode is cut as an opening and side walls are formed on side portions of the opening. A gate insulating film is removed by a self-aligned method using each side wall as a mask, and a thin tunnel oxide is locally formed within the tunnel window.

A method is provided for forming a short and sharp gate bird's beak in order to increase the erase speed of a split-gate flash memory cell. This is accomplished by implanting nitrogen ions in the first polysilicon layer of the cell and removing them from the area where the floating gate is to be formed. Then, when the polysilicon layer is oxidized to form polyoxide, the floating gate region without the nitrogen ions oxidizes faster than the surrounding area still having the nitrogen ions. Conseq...