A method of performing a measurement of properties of a sample, by directing a first beam of light at the sample, where a combination of the wavelength, energy, and length of time is sufficient to cause temporary damage to the sample. The first beam is reflected from the sample. The properties of the reflected beam are sensed to create a signal. A length of time is waited, sufficient for the damage to substantially heal, before a second beam of light is directed at the sample, where a combinatio...

A surface of a work to be inspected is irradiated with an illumination unit for a coaxial incident illumination and an illumination unit for an oblique incident illumination driven to take its image by a camera at the same time. Each of the illumination units and comprises light sources emitting color lights R, G and B, respectively. One of the three kinds of light sources is lighted in the illumination unit and one or two of the light sources which are not lighted in the illumination unit are l...

Methods and apparatuses for testing image sensors are disclosed. Desirable apparatuses of the present invention include image sensor testing devices comprising a digital light projection system capable of projecting static or dynamic images onto an image sensing device under test and an image sensor signal detection means for analyzing the output of said image sensing device under test. The digital light projection system comprises a light source, collimating optics, a digital micromirror device...

A method and apparatus for determining color, presence and/or polarity of a component in a printed circuit board includes a sensor and an LED positioned behind a faceplate. The faceplate abuts the component and light is reflected from the LED off the component and received by the sensor. A resulting output signal is analyzed to determine the color, presence and/or polarity of the component in the printed circuit board, thereby ensuring that the printed circuit board is correctly assembled.

A non-contact vision based inspection system and method for flat specular parts in which an imaging camera defining an image plane is aimed at a part to be inspected for taking a single image of the part. A staging apparatus is used to move the part relative to the camera until the single image of the part is obtained. The image plane is fixed to remain parallel to the object plane defined by the part as the part moves relative to the imaging camera.

An optical element is provided, to move an optical axis of a scanning light incident to a substrate so that illumination positions on photodetecting faces of two photodetectors agree or almost agree with each other. Respective surface information signals sent out from the two photodetectors are accordingly agreed or a difference of the signals is minimized, whereby the measuring accuracy in surface inspection is improved.

In the optical examination of plastic cards, the latter are illuminated with focused light, which is mixed with a diffuse component, in order reliably to discriminate even relatively slight differences in the reflectivity of the surface sections.

When mounting crystal blanks, crystal blanks can be mounted readily in a desired position on a mounting platform, and during pick-up, they can be readily detached from the mounting platform. To inspect scratches in a crystal blank 1, diffused oblique light is shined onto the crystal blank 1 from below by light-emitting diodes 6, and light reflected by scratches on the crystal blank 1 is detected by image capturing means 11 directly above the crystal blank 1. The crystal blank 1 is conveyed to th...

Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the s...

Methods and systems for determining drift in a position of a light beam with respect to a chuck are provided. One method includes illuminating a surface with the light beam. The surface has a predetermined position with respect to the chuck during illumination. The method also includes generating signals responsive to the illumination of the surface and determining the drift in the position of the light beam with respect to the chuck using the signals. One system includes an illumination subsyst...