A surface inspection apparatus comprises a light source, a scan optical system having a scanning means for scanning a wafer surface in a direction of crossing the wafer by luminous flux from the light source, a moving unit for moving the wafer relatively in a direction of a prescribed angle with respect to the scanning direction, a light receiving unit having a photoelectric converter for receiving scattered lights from the wafer surface, and a signal processing unit performing the the surface i...

The present invention is a method for inspecting height, scanning the surface of a subject item having zones of different reflectance with incident light of a prescribed intensity, causing the reflected light from the surface to be imaged with means for detecting light spot positions, and detecting the height of said surface from the light spot position which was imaged, said method comprising: a step of scanning, in a second zone with low reflectance surrounding a first zone with high reflectan...

The present disclosure is a method for in situ monitoring of backside contamination on a semiconductor wafer (120) between processing steps which are performed in a multi-chamber tool (500). In a first form, a laser source (220) and a detector (210) are mounted on a robotic arm (110, 111), or within a semiconductor processing tool (500). The laser (220) and detector (210) move along with the robotic arm (110) as the robotic arm (110) shuffles the wafer (120) between processing carriers (610-650)...

Calibration of pattern recognition in bright field imaging systems is disclosed. A target pattern on a substrate on the stage is brought into focus of a bright field system. The image is scanned in a first direction while measuring an edge scattering pattern from a feature of the target pattern. The edge scattering pattern is characterized by first and second peaks. A position of the bright field system's illuminator or beam shaping and relay optics is adjusted perpendicular to an optical path u...

A pattern inspection apparatus comprises an illumination optics applying a first inspection light on a predetermined wavelength to a surface opposite to a pattern formed surface of the substrate, and a second inspection light whose wavelength is equal to the wavelength of the first inspection light to the pattern formed surface, a detector independently detecting a transmitted light from the substrate by irradiation of the first inspection light and a reflected light from the substrate by irradi...

A method and an apparatus for reviewing defects detected by an optical particle inspection system or an optical profile inspection system in detail by an electron microscope are provided. In order to putting defects to be reviewed in the viewing field of the electron microscope and reducing the size of the apparatus, the electron microscope reviews defects detected by an optical defect inspection system. In the electron microscope, an optical microscope for reviewing detects is arranged, and whe...

Methods, systems, program storage devices and computer program products for mask inspection that automate the detection and placement of do not inspect regions ("DNIR") for intentionally induced defects on masks. A location of an intentional defect is identified on a mask, and then logic relating to this location is translated into a shape that represents a DNIR for the intentional defect. A second shape representing another DNIR of the mask is provided. It is then determined if the first and se...

A measuring instrument for optical inspection of an object includes a light source for illuminating an object; a detector; an illuminating beam path extending from the light source to the object; a detection beam path extending from the object to the detector; an illuminating optics disposed in the illuminating beam path and/or an imaging optics disposed in the detection beam path for imaging the object onto the detector; a position evaluation device for determining a distance between two points...

An inspecting method for inspecting foreign substances, comprising projecting beams from an illumination system arranged above a light-permeable body to be inspected with an angle of incidence of a first elevation angle onto an upper face of the body, and receiving a reflecting light and a scattering light generated by the beams with a photodetecting angle of a second elevation angle by a photodetecting system. The method further comprising, before the beams are projected, setting a width of the...

The invention provides methods and apparatus for defining a pattern on a substrate. An example apparatus includes: an emission source for directing an emission to the substrate, defining a working position between the emission source and the substrate, at least one shadow mask having one or more apertures and at least one inspection device for inspecting the properties of the substrate and/or the pattern, the inspection device having at least one inspection tool. The shadow mask and the inspecti...