Reinforced thermoplastic molding compositions are provided comprising a high molecular weight linear polyester, such as poly(1,4-butylene terephthalate) and another high molecular weight polyester, such as poly(ethylene terephthalate), in combination with talc and one or more reinforcing agents or fillers.

The present invention is directed to a single sheet sandpaper delivery system which includes at least one stackable tray having a support surface, with at least two sides, wherein one of each said sides is connected an opposing edge portion of the support surface and extends generally normal thereto, and wherein the support surface has an edge portion laterally spacing the sides. The present invention further includes at least one sandpaper package having housing portion of a size and configurat...

The present invention discloses a new surface geometry of a polycrystalline diamond (PCD) cutter whereby large chips are prevented from forming in front of the cutter. The surface geometry includes recess(es) and/or raised region(s) that can act as chip breakers and also increase turbulence in the flow across the face of the cutter and thus increase the Heat transfer coefficient and reduce drag. PCD surface's geometric configuration is formed in the high temperature/high heat (HT/HP) process and...

This invention relates to molding compositions comprising mixtures of wholly aromatic polyesters and fillers. These compositions can be molded, with minimal processing difficulties, into useful articles, such as ovenware, having good mechanical properties and pleasing visual appearances.

A specific elastomeric composition is formed by melt blending two particular elastomers, each composed of hard and soft segments made from poly(tetra-methylene ether) glycol, 1,4-butane diol and a phenylene dicarboxylic acid or a derivative thereof. The blend exhibits a melting endotherm that extends from no lower than 120.degree. C. to no higher than 215.degree. C. with a melting peak in the range of 150.degree. to 175.degree. C. Films made from the composition are particularly suited for use a...

There is provide a polishing member including photocatalyst particles that exhibit photocatalysis on light irradiation, and a support material that supports the photocatalyst particles. There is also provided a method of manufacturing a semiconductor device, including polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with the polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performin...

A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.

The present invention relates to polyalkylene terephthalate/polycarbonate blends stabilized with carbodiimides as a sheathing material for optical fibres.

A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of p...

A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.