A rope and method of making the same. The rope comprises a plurality of yarns. At least one of the yarns comprises first and second sets of fibers. The first fibers are formed of a first material, and the second set of second fibers at least partly surrounds the first fibers. The second fibers are formed of a second material. The first material defines a set of operating characteristics adapted to bear tension loads on the rope. The second material defines a set of operating characteristics adap...

A composite crimped yarn comprising: at least two kinds of multifilament yarns, one of them being comprised of a crimped conjugate multifilament yarn comprising two kinds of polyester polymers different from each other in the heat shrinkability and positioned as a major component of the inner layer of the composite crimped yarn, the other of them being comprised of a crimped multifilament yarn of a single synthetic polymer and positioned as a major component in the outer layer of the composite c...

A yarn splicing device and method provides for overlapping yarn ends from different spools or packages of yarn to form a smooth, continuous splice. The device allows the operator to place the different yarn ends in a pair of clamps that are separated by a pneumatic commingling jet. After the yarn is clamped into place the yarn ends, which consist of multi-filament yarns, are pneumatically commingled and thereafter the clamps are rotated in opposite directions from the commingling jet to stretch ...

A false-twisted polyester yarn of good dyeing and mechanical properties is produced by a process wherein a yarn consisting of an as-spun polyester fiber having a mean birefrigence index (.DELTA.n) of from 15.times.10.sup.-3 to 150.times.10.sup.-3 is heat-treated and continuously, subjected to a false twisting treatment or draw-false twisting treatment. A preferred apparatus used comprises a feed yarn creel, a false twisting heater and an optional stabilizing heater, a false twisting element and ...

An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.

A shock absorber having a pressure tube with metering bores defining metering orifices through which fluid is metered upon application of impact forces to a piston assembly slidable in the pressure tube, and an adjustable metering sleeve with ports adjacent the metering orifices for regulating the flow of fluid through the orifices.

An apparatus for polishing semiconductor wafers is provided which is capable of efficiently polishing the semiconductor wafers one-by-one by a multi-step polishing, capable of preventing occurrence of spots and scratches due to attachment and detachment to and from top rings, and capable of polishing the semiconductor wafers with high-flatness surfaces. The polish apparatus includes a plurality of holding shafts for holding the semiconductor wafers, a polish table on which the semiconductor wafe...

A table assembly for use in a wafer preparation module is provided. The table assembly includes a replaceable pad assembly and a permanent pad assembly. The replaceable pad assembly has a removable support element and a pad. A backside of the pad is secured to a front surface of the removable support element. The permanent support element is removeably secured to the replaceable pad assembly. A method for conducting multiple wafer preparation operations in a single processing module, a method fo...

A method and apparatus for forming a planar surface on a substrate at a desired endpoint. In one embodiment of the invention, material is removed from a substrate with an abrasive medium on a planarizing surface. As material is removed from the substrate, the abrasive medium is selectively inhibited from contacting a first exposed area at the desired endpoint on the substrate while it still contacts a second area on the substrate that is not yet at the endpoint. In this embodiment of the inventi...

A method of reducing defectivity during chemical mechanical planarization (CMP) in a system having a wafer membrane and a retaining ring is disclosed. The method includes planarizing test wafers using different values of ring pressure and wafer pressure to determine an optimum ring pressure and wafer pressure, i.e., the ring pressure and wafer pressure that results in a reduced defectivity.