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Results for INVENTOR: chen xia
Showing 1 - 10 of 47
A cleaning chemistry for lowering defect levels on the backside of a semiconductor wafer after chemical mechanical planarization (CMP). In a preferred embodiment of the present invention, a cleaning chemistry comprising nitric acid, hydrofluoric acid, and phosphoric acid in solution with deionized water is applied to the wafer surface to be cleaned preferably while subjected to megasonic assist cleaning. The wafer is preferably then subjected to brush scrubbing and a deionized water rinse with m...
An electric power protection circuit connected in series to a secondary side circuit of a transformer in a switch mode power supply includes a voltage/current limiting device to get an electric power signal output from the secondary side circuit of the transformer that goes through current and voltage limitation before being output and a constant current/voltage controller to get the electric power signal which has the current and voltage limited by the voltage/current limiting device. The elect...
Compositions comprising OB-R agonists and methods of treatment for conditions such as systemic inflammatory response syndrome are provided. One suitable OB-R agonist ligand is recombinant human OB protein, also known as leptin. Also provided are methods and compositions for the treatment of obesity and OB resistance. Assay methods and kits relating to these conditions are also included.
The present invention provides, in one embodiment, a method of forming a metal layer over a semiconductor wafer. The method includes the chemical reduction of copper oxide (105) over the deposited copper seed layer (110) by exposure to a substantially copper-free reducing agent solution (120), such that the copper oxide (105) is substantially converted to elemental copper, followed by electrochemical deposition of a second copper layer (125) over the copper seed layer (110). Such methods and res...
A method for implementing a truly hitless tunable filter for use in adding and/or dropping channels in a wavelength division multiplexed (WDM) network is disclosed. An exemplary method for filtering an optical signal may include providing a composite optical signal having several wavelengths including a first wavelength, a second wavelength and other wavelengths. The method may include passing the first wavelength through a filter and reflecting the second wavelength and the other wavelengths wi...
Compounds of Formula I are useful as mediators of protein kinases and have activity as cell proliferation inhibitors: ##STR00001## where X, R.sub.1 R.sub.7 and R.sub.9 are as defined herein.
An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film (118) is electrochemically deposited.
A method for implementing a truly hitless tunable filter for use in adding and/or dropping channels in a wavelength division multiplexed (WDM) network is disclosed. An exemplary method for filtering an optical signal may include providing a composite optical signal having several wavelengths including a first wavelength, a second wavelength and other wavelengths. The method may include passing the first wavelength through a filter and reflecting the second wavelength and the other wavelengths wi...
A method for implementing a truly hitless tunable filter for use in adding and/or dropping channels in a wavelength division multiplexed (WDM) network is disclosed. An exemplary method for filtering an optical signal may include providing a composite optical signal having several wavelengths including a first wavelength, a second wavelength and other wavelengths. The method may include passing the first wavelength through a filter and reflecting the second wavelength and the other wavelengths wi...
A fluidic micro electro-mechanical system (MEMS) device is described. In one aspect, at least one at least partially covered fluidic channel is formed between a polymer layer and a polymer substrate as the polymer layer is deposited on the substrate. The partially covered fluidic channel is fabricated as a unitary polymer layer structure. In one implementation, a strong exposure process is applied to the polymer layer to create a deep cross-linked polymer region. A weak exposure process is appli...
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