A configurable die detachment apparatus is provided that can be used to handle a wide range of die sizes. The apparatus comprises a pin mounting assembly having a plurality of pin sites for selectively mounting ejector pins in a desired configuration on some of the pin sites and a vacuum enclosure enclosing the pin mounting assembly. The vacuum enclosure has a support platform comprising a plurality of openings that are sized and arranged to accommodate different configurations of ejector pins m...

The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to hold the film. The film may comprise a thermoplastic adhesive tape or B-stage thermoset epoxy coated film.

The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages on the chuck such that the pulsator no...

The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving po...

The invention provides a chuck for holding a workpiece, such as a chip-array semiconductor Chip Scale Packages (CSP) substrate, having a plurality of components such as CSPs to be singulated, and chaff areas of the components. The chuck comprises means to hold the chaff areas when the components are being singulated, that may include a first pressure means to hold the components and a second pressure means to hold the chaff areas.

This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and ont...

A method and apparatus for providing a three-way connection between a mobile computing device, a stationary computing device and a computer network. When there is an established connection between a mobile computing device (e.g. a notebook computer) and the stationary computing device (e.g. desktop PC) over the wireless communication channel (e.g. infrared link), the system operates in BRIDGE mode. In BRIDGE mode the system redirects information packets in the OSI layer 2 (data link layer). When...

Packages of varying dimensions are loaded into a plurality of electrical package tubes. A guide arrangement is provided, which is programmable to receive the electrical packages by automatically configuring to accommodate the varying dimensions of the electrical packages, the configuring being performed without manual intervention, and a receiving arrangement is provided to receive the electrical package tubes and configured to individually align the electrical package tubes with the guide arran...

A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axi...

An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for...