A soldering alloy which contains 40-98% by wt. of Pb; 1.8-50% by wt. of Sn; 0.05-10% by wt. of Zn; and 0.05-10% by wt. of Sb. A process for adhering said solder to a solid inorganic oxide product, such as glass or ceramic whereby ultrasonic vibration is applied.

An improved control apparatus includes an auto-choke for an engine provided by interlocking a choke lever and a throttle lever of a carburetor by way of a temperature-sensitive interlocking rod. The choke lever of the carburetor is provided with a spring for resiliently biasing the choke valve toward its open position. The interlocking rod is made of high molecular material such as high molecular urethane elastomer or the like and has a buckling threshold which varies in dependence upon the temp...

A method of manufacturing hollow rods of very thick wall, in which wall thickness to outside diameter ratio is 25% or more, such as those used as work stock for manufacturing oil-well drilling collars. A cross-type or rotary mill having three or four cone-type rolls is employed without using internal sizing tools such as plug or the like, whereby a hollow work piece is worked and reduced in both outside diameter and wall thickness to the target values. In order to obtain higher dimensional accur...

The invention relates to a method of manufacturing solid metallic materials having a circular cross section by employing a rotary mill. A three or four roll cross-type rotary mill is employed, with cross and feed angle setting selected so as to meet specific conditions. The method permits efficient production of metallic materials without internal cracks or internal fracture initiated from porosity. In one version of the method the material being worked is rotated. In another version the materia...

A fibrous sheet having the shape memory property which comprises a sheet made of natural fiber and/or synthetic fiber and a layer formed by applying a powder of shape memory polymer; and a method of imparting the shape memory property which comprises applying a powder of shape memory polymer to a desired part of a product of a sheet made of natural fiber and/or synthetic fiber by the aid of a resin adhesive.

An apparatus for preventing the oxidation of a lead frame in a bonding system. The apparatus has a first introducing device for introducing a first atmospheric gas toward a bonding portion of the lead frame and a second introducing device for introducing a second atmospheric gas to shield the bonding portion from contact with ambient air simultaneously with the introduction of the first atmospheric gas.

A disc driving apparatus and an information readout method according to the present invention realize optimum servo control of a readout unit in reading out the information from a recording medium having lands and grooves. The disc driving apparatus includes a unit for correcting tracking error signals, a unit for inverting signals corrected by the correcting unit to generate inverted tracking error signals, a unit for detecting which of the lands and the grooves the readout unit is scanning, an...

Improved transportation accuracy of a lead frame and reduced transportation time is attained. On the both sides of a heat block (1), rails (3a) equipped with a vertical drive mechanism are provided. By rotation of a screw shaft (7), a lead frame (4) is moved from front side to rear side of the heat block (1) along guide rails (3b) and the movable rails (3a) while holding the lead frame (4) by a clamp (5c) which has freedom of horizontal and vertical movements. During this transportation, a senso...

A method of communication between a base station with at least a mobile unit communication apparatus, a base station and a mobile unit communication apparatus employing the method are disclosed. The base station has a plurality of antennas for the antenna diversity. Transmission data is spectrum-spread with a pn code for a target mobile unit communication apparatus and a pilot signal is also spectrum-spread with a pn code every antenna, which are frequency-multiplexed. A mobile unit de-spectrum-...

A semiconductor device has a lead, an inner lead of which is upwardly bent while an outer lead is downwardly bent. A junction part of the outer lead is guided from a resin block on a level which is lower than that of an upper major surface of the semiconductor chip. In fabrication of this semiconductor device, a guide frame of a lead frame, a suspending lead and a die pad held by the same are flush with each other.