The present invention relates to a method of electropolishing aided by ultrasonic means having the capability of rapidly discharging dregs. More specifically, the invention relates to a method of electrochemical polishing process aided by an auxiliary ultrasonic cleaning device which emits ultrasonic vibrating energy to effectively discharge dregs, shorten the polishing cycle time for each workpiece, and improve the surface roughness of the workpiece. The present invention further provides an el...

A system for nano-imprint with mold deformation detector is disclosed for real-time monitoring of the deformation of the mold. An electrostatic plate capacitor is embedded in the mold, serving as the deformation detector. The capacitor includes two opposite metal film electrodes formed by silicon micromachining technique on opposite surfaces of the mold and connected by a metal lead. During imprinting, the mold is acted upon by an external force and deformation occurs, which induces change of di...

The present invention provides a method for in-situ real-time monitoring of mold deformation by using a database to store temporary information during the following steps: (a) providing a mark on the mold body that is easy to observe in order to monitor the mold deformation, (b) installing a signal source and a monitor device for monitoring the deformation quantity on the mold, (c) transforming the above deformation quantity into computer signals for storing in the database and (d) issuing contr...

A method for detecting the endpoint of a chemical mechanical polishing (CMP) process uses the slope variation of temperature difference of polishing pad. The method combines temperature measurement at polishing pad and atmosphere, and numerical analysis to figure out the curve of temperature difference variation versus polishing time. The endpoint of CMP is determined by the change of the slope of the curve. The method allows endpoint to be detected in-situ at the polishing apparatus, without st...