An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec...

Novel fluorine-modified acid anhydrides of formula (1) are useful curing agents typically in epoxy resin compositions for encapsulating semiconductor devices. ##STR1## R.sup.1 is a hydrogen atom, substituted or unsubstituted monovalent hydrocarbon group, hydroxyl group, alkoxy group or alkenyloxy group. Rf is a divalent perfluoroalkylene or perfluoropolyether group of the general formula (2): ##STR2## wherein l is an integer of 0 to 8, k and m are integers of 0 to 15, j and n are 0 or 1, with th...

An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.

A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated ...

An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 .mu.m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

A compound represented by the formula: ##STR00001## [wherein R.sup.1 is methoxy, methylthio, ethyl, etc.; R.sup.5 and R.sup.6 are each independently cyclopropylmethyl, (4-tetrahydropyranyl)methyl, etc.; and two of R.sup.40, R.sup.41 and R.sup.42 are C.sub.1-6 alkoxy while the remaining one is methoxymethyl, etc.], a salt thereof, or a hydrate of the foregoing. This compound has excellent antagonism against corticotropin-releasing factor receptor.

A compound represented by the formula: ##STR00001## [wherein R.sup.1 is methoxy, methylthio, ethyl, etc.; R.sup.5 and R.sup.6 are each independently cyclopropylmethyl, (4-tetrahydropyranyl)methyl, etc.; and two of R.sup.40, R.sup.41 and R.sup.42 are C.sub.1-6 alkoxy while the remaining one is methoxymethyl, etc.], a salt thereof, or a hydrate of the foregoing. This compound has excellent antagonism against corticotropin-releasing factor receptor.

A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame reta...

A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25.degree. C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achie...