
A socket for a semiconductor device having solder balls includes a circuit substrate, an interposing sheet and a holder. The circuit substrate has conductive bumps on one side thereof corresponding to the solder balls, respectively. The interposing sheet has interposing electrodes through the interposing sheet corresponding to the solder balls, respectively. The diameter of each interposing electrode is greater than that of each solder ball. The holder holds the semiconductor device on the circu...











