A process for manufacturing heat-sealable packaging materials which are permeable to air, from a paper, cardboard, pasteboard, or corrugated cardboard base material comprising the steps of applying to the said base material an organic solvent solution consisting essentially of (1) from 10 percent to 50 percent by weight based upon the total solution weight of a thermoplastic material, (2) from 10 percent to 80 percent by weight based upon the weight of solid matter in the solution of an organic ...

A high-frequency plastic welding flux, characterized in that the dispersion contains a redispersible powder of a polymer prepared by suspension polymerization which consists of polyvinyl chloride and/or copolymers of vinyl chloride with monomers copolymerizable with vinyl chloride; as well as a process for using this flux for high-frequency welding.