Disclosed is an adhesive resin composition for bonding semiconductor chips comprising an epoxy resin component, a curing agent, a diluent, a curing promoter, a thixotropic agent, and an inorganic filler component. The resin component is approximately 10-50% by weight, and the inorganic filler component is approximately 50-90% by weight and comprises a copper ingredient and a silver ingredient. The copper ingredient is selected from the group consisting of CuO, Cu.sub.2 O, with the mixtures there...

A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrating the ultrasonic wave. A capillary is coupled to a front section of the horn. The capillary has a channel running the length thereof. A wire is inserted through the channel. A discharge device is coupled to the capillary for forming ...

A TDD (Time Division Duplexing) CDMA (Code Division Multiple Access) communication system performs power control in a closed-loop power control mode in a data transmission period, but performs the power control using a modified open loop power control method and an open loop power control method as well as the closed-loop power control method in a transmission pause period, thereby to properly set initial transmission power after the end of the transmission pause period.

A liquid crystal display (LCD) device and method for manufacturing the same in which a plurality of patterns are formed on one substrate reduces the manufacturing cost and simplifies the process steps by minimizing the number of masks required to form the patterns. The LCD device includes first and second substrates, a thin film transistor (TFT) formed in a predetermined region on the first substrate, a pixel electrode formed in a pixel region on the first substrate, a color filter layer formed ...

A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor packa...

A liquid crystal display (LCD) device and method for manufacturing the same in which a plurality of patterns are formed on one substrate reduces the manufacturing cost and simplifies the process steps by minimizing the number of masks required to form the patterns. The LCD device includes first and second substrates, a thin film transistor (TFT) formed in a predetermined region on the first substrate, a pixel electrode formed in a pixel region on the first substrate, a color filter layer formed ...

Disclosed is a method for measuring a propagation delay value of a frame transmitted by a UE (User Equipment) to a Node B in a TDD (Time Division Duplexing) mobile communication system. The UE acquires synchronization with the Node B based on a downlink pilot channel signal transmitted in a period of a downlink pilot time slot, and determines an estimated round trip delay value T1 by comparing transmission power of a physical common channel signal in a first time slot with reception power of the...

In a mobile communication system, if a UE enters a SHO (Soft Handover) region, the UE determines weight information for a DPCH and a PDSCH depending on DPCH signals and PDSCH signals received from Node Bs, and transmits the determined weight information to the Node Bs. The Node Bs then determine weights of the DPCH signals and the PDSCH signals to be transmitted to the UE depending on the feedback information received from the UE, and transmit the determined weights to the UE along with the DPCH...

A method for fabricating a semiconductor device having fine contact holes is exemplarily disclosed. The method includes forming an isolation layer defining active regions on a semiconductor substrate. An interlayer dielectric layer is formed on the semiconductor substrate having the isolation layer. First molding patterns are formed on the interlayer dielectric layer. Second molding patterns positioned between the first molding patterns and spaced apart therefrom are also formed. A mask pattern ...

A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor packa...