A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) ##STR00001## (X is a single bond, CH.sub.2, C(CH.sub.3).sub.2, SO.sub.2, S, 0, or O(CO)O; n is an integer of from 3 to 1000; d and e are numbers with 2d+e=2n), and a resin layer. The phosphazene compound is supported on the inorganic porous fine particle, and the resin layer coats the inorganic porous fine particle with the phosphazene compound sup...

A safety wheel including a combined flat protector and bead stopper structure radially fitted in the tire around the inner periphery thereof and having a closed frame-like cross-sectional configuration of a substantial modulus of section. The flat protector, being made itself of an elastic material in a substantially H-shaped cross section, is easily deformable and can be readily inserted in the tire and, once combined with the bead stopper, which clamps the opposite side wall portions of the fl...

A safety wheel designed so that when air sealed within a tire is lost, the vehicle may be supported by a flat protector and bead stopper members in place of air pressure within the tire. The safety wheel comprises a split rim, a tubeless tire mounted on the split rim, and a flat protector of an annular configuration. The flat protector is divided into a plurality of circular protector elements whose opposed opposite ends are connected with each other through the bead stopper members adapted to r...

A tubeless tire and rim assembly including an annular bead lock in the form of an endless train of lock elements interconnected by flexible joints. The bead lock can have not only a fully expanded circular configuration to fit over the rim base but also a partly folded configuration to lie within the inner peripheral circle of the tire. This particularly facilitates the mounting of such bead lock while effectively preventing any improper positioning thereof. An embodiment incorporating a flat-pr...

A safety wheel designed so that when air sealed within a tire is lost, the vehicle may be supported by a flat protector device in place of air pressure within the tire. The safety wheel comprises a split rim, a tubeless tire and a flat protector device which comprises a flat protector seat portion annularly fixed along the outer peripheral surface of the split rim, and a flat protector body formed of at least one pipe annularly fixed along the outer peripheral surface of the flat protector seat ...

A run-flat support and tire assembly designed so that when air sealed within a tire is lost, the vehicle may be supported by support members in place of air pressure within the tire. The run-flat tire has a split rim, a tubeless tire mounted on the rim, and a plurality of annularly disposed circular support members. The support members each comprises a thin-wall casing body having lattice-like reinforcing ribs for partitioning the interior of the casing body into a plurality of chambers. Connect...

An Al-base alloy prepared by hot-working a mixture of an Al alloy powder and dan Ni powder to join the powders and having a structure wherein Ni--Al intermetallic compounds are dispersed. The powder mixture can be hot-worked in the solid-phase temperature range, liquid phase temperature range or solid-liquid phase mixture temperature range of the Al alloy. A dispersion strengthening powder can be further admixed with the mixture of Al alloy powder and Ni powder.

In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.

An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.