A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a rotary drum provided on a surface thereof with a polishing pad. A stand supports the workpiece to be polished. A controlling device controls reciprocation of the drum and rotation of the workpiece to obtain a relationship: in which V represents velocity of reciprocation of the drum reciprocating on the workpiece to polish an entire surface of the workpiece, .omega. represents rotation...

An insulating film includes an oxide of a metal selected from Hf and Zr, the oxide being doped by at least one of Ba, Sr and Mg. And the insulating film satisfies the following formula (1): 0.06 at %.ltoreq.[Ba]+[Sr]+[Mg].ltoreq.1.4 at % (1) wherein [Ba] represents atomic % of Ba, [Sr] represents atomic % of Sr, and [Mg] represents atomic % of Mg.

A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of th...

To provide a screw vacuum pump which is compact and yet capable of attaining a high degree of vacuum. A screw vacuum pump having a pair of male and female rotors 7 and 7A rotating in mesh with each other around two parallel axes, respectively, and a casing 1 for accommodating the two rotors 7 and 7A, the casing 1 having a suction port 8b and a discharge port 9b, the screw vacuum pump further having a process of sucking a gas from the suction port 8b into a space defined between the rotors 7 and ...

A screw vacuum pump is designed so that it is possible to reduce the load on the pump at the time of starting and evacuation of a gas under atmospheric pressure. The screw vacuum pump has male and female rotors rotating in mesh with each other around two parallel axes, respectively, and a casing for accommodating the rotors, the casing having a suction port and a discharge port, wherein the discharge port is formed so that V.sub.1 /V.sub.2 is in the range of 1.5 to 0.51, where V.sub.1 is a groov...

A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of th...

A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of th...

A color concentrate which comprises (a) one or more of polypropylene resins and propylene copolymers having a melt flow rate in the range of 0.1-100, (b) one or more of organic and inorganic pigments; and (c) one or more pigment dispersants selected from the group consisting of polyethylene wax, polypropylene wax and derivatives thereof, zinc stearate, magnesium stearate, aluminium stearate, calcium stearate and ethylene bisamide, the contents of (a), (b) and (c) being, respectively, 11-30 wt %,...

The cleaning apparatus of the present invention comprises a cleaning member 105 adapted to be rotated while maintaining contact with a surface of a semiconductor wafer W, to thereby clean the surface of the semiconductor wafer W, and a drive motor 50 for rotating the cleaning member 105. A linear bushing 75 and coil springs 81 are provided between the cleaning member 105 and the drive motor 50. The linear bushing 75 ensures that the cleaning member 105 is capable of slidably moving in a directio...

A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being...