
A method is disclosed for preparing a substrate and epilayer for reducing stacking fault nucleation and reducing forward voltage (V.sub.f) drift in silicon carbide-based bipolar devices. The method includes the steps of etching the surface of a silicon carbide substrate with a nonselective etch to remove both surface and sub-surface damage, thereafter etching the same surface with a selective etch to thereby develop etch-generated structures from at least any basal plane dislocation reaching the...








