A ring oscillator including a voltage-to-current converter for producing at least one control current from at least one control voltage and, a plurality of delay cells coupled to the converter, wherein at least one output of the one of the delay cells is coupled to the input of another of the delay cells, wherein the voltage-to-current converter produces a substantially linear output when the at least one control voltage is varied between zero volts and a rail supply voltage. Since the ring osci...

A method of chemically polishing a metal layer on a substrate is provided. The metal layer is chemically polished using an electrochemical polishing (ECP) process. In the ECP process, the substrate is immersed in a chemical polishing solution including a surfactant. The surfactant in the polishing solution covers the surface of the substrate such that only topographic portions of the substrate surface are exposed to the chemical polishing solution. Thereafter, an electrical potential applied to ...

An integrated circuit has a phase-locked loop (PLL) frequency synthesizer circuit which has a charge pump circuit for providing an output control voltage to adjust an oscillator frequency in response to fast and slow signals provided by a phase detector. The charge pump circuit has first and second current sources, and a switching network for selectively coupling, in response to said fast signal, the first current source to one of an internal node and an output node coupled to an output capacito...

A phase-locked loop (PLL) circuit having a voltage-controlled oscillator (VCO) is automatically calibrated for VCO center frequency and VCO gain during power up or responsive to a calibration signal. The VCO has several input voltage versus output frequency operating curves. During a calibration phase, proper VCO center frequency is selected by selecting one of the operating curves. VCO gain is then determined using the selected VCO operating curve. If the value of VCO gain is not within predete...

A phase-lock loop (PLL) circuit provides fast locking and low spurious modulation jitter through "gearshifting" control. The gearshifting PLL combines the advantages of low jitter from integer-N PLL and fast locking from fractional-N PLL. The PLL circuit includes a phase/frequency detector, a charge pump, a loop filter, and a voltage controlled oscillator (VCO). Control of the PLL circuit includes configuring the PLL circuit in two configurations, one for each phase of operation. The bandwidth o...

Metal CMP with reduced dishing and overpolish insensitivity is achieved with an abrasive-free polishing composition having a pH and oxidation-reduction potential in the domain of passivation of the metal and, therefore, a low static etching rate at high temperatures, e.g., higher than 50.degree. C. Embodiments of the present invention comprise CMP of Cu film without any abrasive using a composition comprising one or more chelating agents, one or more oxidizers, one or more corrosion inhibitors, ...

A method is provided for photochemical polishing of a silicon wafer using electromagnetic waves within the spectrum of 150 to 2000 nanometers wavelength. A photochemical polishing apparatus is also disclosed in which the electromagnetic waves are provided by a waveguide in close proximity to the surface of a silicon wafer electrode.

A ring oscillator comprising: a plurality of sub-feedback loops, each comprising a pair of serially connected inverters and a feedback inverter having its input coupled to the output of the pair of inverters and its output connected to the input of the pair of inverters, the pairs of inverters being connected in a ring, and a downstream inverter of each respective pair of inverters forming an upstream inverter of an immediately following pair of inverters.

In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolution current density. This causes a reaction that provides a planarized surface on the metal wafers. Additives are included in the electrolyte solution (55) which adsorb onto the wafer surface urging a higher removal rate at higher spots and a lower...

A photochemical polishing apparatus is disclosed in which the electromagnetic waves are provided by a waveguide in close proximity to the surface of a silicon wafer electrode.