The inorganic filler in the inventive epoxy resin-based composition is a combination of two kinds of quartz powder of which one is a quartz powder having a spherical particle form and the other is a pulverized quartz powder in a specified proportion. The resin composition is highly flowable and capable of giving encapsulation of semiconductor devices with little fins having outstandingly small thermal expansion coefficient and highly resistant against crack formation.

A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into ...

An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor ...

Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##...

In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m.sup.2 /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 .mu.m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Epoxy resin compositions comprising (A) a crystalline epoxy resin, (B) a polyfunctional phenolic resin, (C) an organic phosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) at least 88 wt % based on the composition of an inorganic filler are smoothly flowing, fast curing and shelf stable. Due to minimized package warp, minimized wire flow, improved adhesion, and low water absorption, the compositions enable highly reliable encapsulation of semiconductor devices, especially BG...

An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a specific phenolic resin preferably in admixture with a conventional phenolic resin, especially naphthalene ring-containing phenolic resin, and (C) an inorganic filler shows good flow and cures to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition...

Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.

By removing a fraction of fine particles having a particle size of less than 2 .mu.m from starting inorganic filler particles having a mean particle size of 10-50 .mu.m and adding thereto particles having a mean particle size of 0.1-2 .mu.m and a specific surface area of 3-10 m.sup.2 /g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 .mu.m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a ...

An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a bloc...