An epoxy resin composition containing an N,N'-unsaturated amic acid compound represented by the general formula, HOCO--R.sub.2 --CONH--R.sub.1 --Y, wherein R.sub.1 is a divalent group having 2 or more carbon atoms, R.sub.2 is a divalent group having a carbon-to-carbon double bond, and Y is ##EQU1## or --NHCO--R.sub.2 --COOH. The composition is characterized, by being favorable in curing characteristics, heat resistance, and flame retardance.

A thermosetting resin composition comprising (A) at least one polyfunctional epoxy compound and (B) at least one polyfunctional nitrile compound and a prepolymer thereof can give a cured product having excellent heat resistance and mechanical properties such as flexibility.

A copper barrier type, nuclear fuel cladding is produced by forming an oxide layer on the inner wall surface of a tube of zirconium or zirconium alloy and then applying electroless copper plating to the oxide layer with a solution containing at least a copper salt, a complexing agent, a reducing agent, and 2,2'-dipyridyl, or further together with polyalkylene glycol as a plating solution. A good adhesiveness is obtained between the copper barrier layer and the oxide layer.

An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting age...

Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of: (I) forming a plating resist on a negative pattern of circuit with a masking material having an effect upon reducing the deposition of an initiator for electroless metal plating, and depositing the initiator onto the entire surface of the insulating substrate, (II) removing the initiator from the surface of said resist, and (III) dipping the insulating substrate in an ...

Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subj...

A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two ...

A process for preparing a thermosetting maleimide type prepolymer which comprises heating (A) a polyfunctional maleimide compound derived from a polyamine prepared from aniline and formalin, (B) a bis-maleimide and (C) a diamine. The thermosetting maleimide type prepolymer prepared according to the process of the present invention is excellent in solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the ...

A thermosetting resin composition comprising (a) a polyfunctional maleimide, (b) at least one member selected from the group consisting of alkenylphenols and alkenylphenol ethers, and (c) an allyl ester of polyvalent carboxylic acid, or cyanuric or isocyanuric acid and a prepolymer obtained by preliminarily heating the thermosetting resin composition can be used as a solventless type varnish for impregnating, e.g. electric windings, or for preparing a prepreg, and can give a cured product with h...

A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.