A variable pulley system incorporating driver and driven pulleys in which a flange of the driver pulley has a rim to receive the belt or the like connecting the pulleys in the final drive ratio of the pulleys.

A data communication system and method are provided to communicate in a multiprocessor interconnection network or other network. In one embodiment, the present system includes a number of logical circuits that are located in a number of nodes interconnected in a multiprocessor interconnection network. In this regard, the nodes include at least one source node, at least one destination node, and at least one intermediate node. The logical circuits include source logic located in the source nodes ...

A motorized device for removing nail coatings such as fingernail polish or the like and usable by either a professional manicurist or by an individual caring for her own nails, the invention includes a container controllably rotatable in both clockwise and counter-clockwise directions, the container receiving a single-use cartridge filled with a flexible foam body saturated with a solvent capable of removing the coating. In the environment of a beauty salon, a client inserts each nail sequential...

A motorized device for removing nail coatings such as fingernail polish or the like and usable by either a professional manicurist or by an individual caring for her own nails, the invention includes a container controllably rotatable in both clockwise and counter-clockwise directions, the container receiving a single-use cartridge filled with a flexible foam body saturated with a solvent capable of removing the coating. In the environment of a beauty salon, a client inserts each nail sequential...

A system and method for data communication in a multi-controller environment is disclosed. The system and method utilize a sequence number protocol to filter duplicate packets, adapt to transient errors, and to reroute data packets to avoid hardware malfunctions. The system and method further employ a transaction database to track packet communication in accordance with the sequence numbers. Moreover, the system and method may be implemented in hardware or software to provide a transparent trans...

An endless power transmission belt having a reinforcing and tension member, such as a cord or cloth strip, to which are attached, stiffener and about which is an elastomeric material. The stiffeners for providing lateral stiffness may be finger-like, at least in parts, and adhesively attached to the reinforcing and tension member or molded therearound. The stiffening means may be individual, side-by-side parts or a continuous member.

An endless power transmission belt having a reinforcing tension and lateral stiffening means, an endless one-piece plastic member. The member is formed with alternate rod-like portions and hinge portions and the entire member is bonded to the elastomeric body of the belt. Such belt is especially adaptable for transmitting power in variable pulley drives and the like.

A power transmission belt comprising an elastomeric body and longitudinally spaced, lateral stiffening members extending substantially the width of the body. The stiffening members may be of multiple piece construction and joined to a longitudinal reinforcing tension member in the body of the belt. Additional edge pads may be attached to the stiffeners at the edges of the belt. The belt of this construction is especially adaptable for use to transmit power in variable pulley drives and the like.

A semiconductor chip package structure for providing a reliable interface between a semiconductor chip and a PWB to accommodate for the thermal coefficient of expansion mismatch therebetween. The interface between a chip and a PWB is comprised of a package substrate having a plurality of compliant pads defining channels therebetween. The package substrate is typically comprised of a flexible dielectric sheet that has leads and terminals on at least one surface thereof. The pads have a first coef...

A method for making a semiconductor chip package. At least one compliant pad is provided on a surface of a substrate and a chip unit is attached to the at least one compliant pad. The at least one compliant pad has a first coefficient of thermal expansion ("CTE"). An encapsulant having a second CTE lower than the CTE of the compliant pads is disposed around the at least one compliant pad to form a composite layer between the chip unit and the substrate.