A motor apparatus is provided with a yoke housing, a gear housing and a brush holder. A receiving portion of the gear housing receives the worm wheel, etc. therein. The brush holder is interposed between the yoke housing and the gear housing. The worm wheel is provided with a switching plate on one side face thereof, which is in slide contact with contact members. The gear housing is provided with a housing body and a cover. In the housing body is formed a communication hole to communicate an in...

A large-area semiconductor wafer with a backing member attached on one of its principal surfaces is divided into a plurality of small-area semiconductor pellets. A glass film is coated on the selected surface of each pellet and thereafter the pellets are detached from the backing member.

An improved dielectric insulator separated substrate for semiconductor integrated circuits is obtained by forming a lamination of at least three thin-polycrystalline layers and dielectric films interposed therebetween on a thick polycrystalline layer of the substrate. A thickness x(.mu.m) of each of the thin-polycrystalline layers is represented by the formula: where y is an ultimate thickness of the substrate. By employing the lamination, it is possible to avoid curveness deformation of the sub...

Initiation of coupling between an input disk and a clutch disk at a maximum rotational coupling force without making relative rotation between the input disk and the clutch disk is enabled only when the output shaft is placed in a single engageable point within a normal reciprocal angular range of the output shaft. When a load applied to the output shaft is equal to or greater than a predetermined value, the input disk and the clutch disk are decoupled from one another, so that the relative rota...

A semiconductor device having a composite film as a passivating film formed on the surface of the device in the order of films of silicon oxide formed by thermal oxidation, phosphorous glass, silicon oxide formed by chemical vapor deposition and silicon nitride, whereby cracks, which occurs in the film when the phosphorous glass film is in contact with the silicon nitride film, can be eliminated.

An integrated semiconductor rectifier device comprising a semiconductor substrate having a pair of mutually opposed principal surfaces, said substrate including a plurality of function regions of diodes or thyristors with their end surfaces exposed at said pair of principal surfaces respectively with an isolation region provided therebetween.

In a high-withstand-voltage (high-breakdown voltage) semiconductor device in which the main PN junction is of planar structure and a field limiting ring region is provided outside and around the exposed end of the main PN junction, a groove is formed between the main region to form the main PN junction and the field limiting ring region, the bottom of which groove is shallower than that of each of the regions and in the surface of which groove the end of the main PN junction and one of the ends ...

A liquid discharging head for discharging liquid droplets utilizing generated bubbles by heating liquid to bubble comprises discharge port for discharging liquid droplets, bubbling chamber communicated with the discharge port for filling liquid; heat-generating member arranged in the bubbling chamber, being supported in a state of having gaps on both sides to the inner wall faces of the bubbling chamber; and supporting portion for supporting the heat-generating member. Then, after the generation...

A composite joint system is disclosed in which a composite structure containing carbon fibers embedded in a copper matrix in any configuration, e.g. in one direction, in random directions, in mesh form, spirally or radially is joined to another structure through a brazing material such as solder, Al brazer or Ag brazer. A film of metal such as Ni, Cr, Mo, W, Ta, Ti, Zr, V, an alloy of one or some of such metals, or the combination of some thereof is interposed between the composite structure and...

An electrical connector with enhanced grounding characteristics which reduce the possibility of signal transmission error includes a connector housing formed from an electrically insulative material, a plurality of conductive terminals mounted on the connector housing, the terminals having tail portions which extend out of and away from the connector housing for attachment to a printed circuit board. A conductive grounding plate, in the form of a metal shield, is mounted to the exterior of the c...