This invention relates to a means for bonding windows into automobile bodies. A bonding strip comprising a curable synthetic polymeric material having an electrical conductor running therethrough is used.

Controlled pressure is put onto workpieces which are being bonded by diffusion bonding, or other processes involving heating the workpiece, by a fixture which develops the pressure by differential thermal expansion between inner and outer members of the fixture.

A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a bonding tool 14 abutting on the object to be bonded, and a pressing unit pressing the bonding tool to the object to be bonded. The bonding tool includes a transversely elongated horn, a vibrator 17 applying a longitudinal vibration to the horn 15 in a first direction along the longitudinal direction of th...

Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and ine...

Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and ine...

In an apparatus and method for obtaining offset amount between a reference pattern on, for instance, a semiconductor device and a bonding tool in order to specify bonding points on the semiconductor device, a reduction process is performed on the high-magnification image acquired by a first camera, and this processed image is compared with a low-magnification image acquired by a second camera, thus obtaining an amount of deviation between an image center mark that constitutes the reference point...

An apparatus for bonding such as wire bonding or inner lead bonding comprises a holding unit for holding an object to be bonded, a supporting unit for mounting thereto the holding unit, a driving unit for moving upwardly and downwardly the supporting unit, and a drive control circuit for controlling the driving unit in accordance with stored information about operations of the supporting member. The bonding apparatus includes a control unit for changing a gain characteristic of the drive control...

A method of adhesively bonding or welding a first plastic surface to a second plastic surface is described which comprises the steps of: (I) applying to the first surface or second surface or both surfaces, a composition which is free of hollow microspheres and comprises a mixture of (A) from about 5% to about 60% by weight of at least one water-insoluble polymer selected from ABS, PVC, CPVC or mixtures thereof; (B) from about 1% to about 60% by weight of at least one water-insoluble polymer sel...

Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the ...

A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconducto...