A process of producing fat free chips cooks the chips and while at elevated temperature and containing sufficient moisture to form the desired pore structure in the chips subjects the chips to sub-atmospheric pressure to expand the moisture into stream and form small pores within the chip structure to provide a cooked fat free product have a similar texture and taste to that of convention deep fried chips.

A resistor element has a ceramic body with a first outer electrode and a second outer electrode formed on its mutually opposite externally facing end surfaces and a plurality of mutually oppositely facing pairs of inner electrodes inside the ceramic body. Each of these pairs has a first inner electrode extending horizontally from the first outer electrode and a second inner electrode extending horizontally from the second outer electrode towards the first outer electrode and having a front end o...

An arrangement for removing material from a workpiece, includes a support component for an elongated workpiece, and a tool component rotatable about an axis and having a circumferential cutting face and axial end faces. The tool component is supported at both end faces thereof. At least one of the above-mentioned components is movable relative to the other component in a predetermined path at least one of the path and axis of rotation is inclined relative to the elongation of a supported workpie...

A chips-deoiling machine, which is characterized in that a group of separators consisting of a number of single separators being spaced controllably in equal intervals in relation to the neighboring separators, which group of separators is provided within a carrying passage through which chips thrown into a chips-charging port are carried toward a chips-discharging port with the aid of the rotation of a screw shaft, and that the cutting oil contained in said chips is separated through the respec...

A system for encapsulating semiconductor chips, such as chips carrying chemical sensitive field-effect devices, includes lamination of a sheet of dry film photoresist material onto the surface of the chip, placement of a photomask over the chip in a predetermined alignment, and then exposure of the photomask to light so that light passes through certain light-transmitting portions of the mask onto the chip. The photoresist material is then developed to remove the material from over the gate regi...

Potato chips of relatively low oil content are prepared by a process which comprises the steps of forming potatoes into slices having a thickness which is suitable for making potato chips, drying the slices in a mono-layer by exposing both major surfaces of the slices to contact with a gaseous atomosphere under drying conditions whereby the average moisture content of the slices is reduced to about 30 to 65% by weight, contacting the resultant dried potato slices with steam under conditions wher...

A solderless capillary chip formed of a corundum-system precious stone such as ruby or sapphire, for use in electrical windings and the like. The inner bore of the chip is enlarged adjacent the exit end thereof, to permit relaxation of the wire to be pressure-bonded and thereby provide an improved contact situation for the next pressure-bonding operation.

Disclosed is a bonding and packaging scheme for semiconductor device chips with particular application to semiconductor monolithic display chips. The display chip is bonded face down in a recess formed in a transparent substrate. In one embodiment, the metallization on the chip is aligned and made coplanar with the auxiliary metallization on the substrate, and the gap between the metallizations is bridged by a conductive material. This can be accomplished, for example, by solder reflow or epoxy ...

Improvement in a conveyor, particularly for chips, comprising hollow conveyor rods movable back and forth adjacent the bottom of a conveyor trough, said conveyor rods being guided on posts extending from the bottom of the conveyor trough through openings into the inside of the conveyor rods, said conveyor rods having conveying elements including barb-shaped pushing blades which occupy only a fractional portion of the cross section of the conveyor trough, the improvement comprising slide bars ass...

An array of transistors is formed in a monocrystalline semiconductor wafer. The wafer is hot press bonded to a thermoplastic sheet. The wafer is scribed and broken to separate the individual transistors. The sheet is stretched over a frame to space the transistor chips from each other. A piece of metallized film is placed metal-side-down over the matrix of chips. This assembly is placed within a resilient cushion and enclosed within a shipping box that inter alia compresses the cushion so as to ...